JPS5641178B2 - - Google Patents

Info

Publication number
JPS5641178B2
JPS5641178B2 JP8410978A JP8410978A JPS5641178B2 JP S5641178 B2 JPS5641178 B2 JP S5641178B2 JP 8410978 A JP8410978 A JP 8410978A JP 8410978 A JP8410978 A JP 8410978A JP S5641178 B2 JPS5641178 B2 JP S5641178B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8410978A
Other versions
JPS5437687A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25254125&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPS5641178(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed filed Critical
Publication of JPS5437687A publication Critical patent/JPS5437687A/ja
Publication of JPS5641178B2 publication Critical patent/JPS5641178B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00—Bipolar junction transistors [BJT]
    • H10D10/01—Manufacture or treatment
    • H10D10/061—Manufacture or treatment of lateral BJTs 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/133—Emitter regions of BJTs
    • H10D62/134—Emitter regions of BJTs of lateral BJTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0112—Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0112—Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs
    • H10D84/0116—Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs the components including integrated injection logic [I2L]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials

Landscapes

  • Bipolar Transistors (AREA)
  • Bipolar Integrated Circuits (AREA)
JP8410978A 1977-08-31 1978-07-12 Method of producing double diffusion lateral transistor Granted JPS5437687A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/829,302 US4110126A (en) 1977-08-31 1977-08-31 NPN/PNP Fabrication process with improved alignment

Publications (2)

Publication Number Publication Date
JPS5437687A JPS5437687A (en) 1979-03-20
JPS5641178B2 true JPS5641178B2 (ja) 1981-09-26

Family

ID=25254125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8410978A Granted JPS5437687A (en) 1977-08-31 1978-07-12 Method of producing double diffusion lateral transistor

Country Status (4)

Country Link
US (1) US4110126A (ja)
EP (1) EP0007923B1 (ja)
JP (1) JPS5437687A (ja)
DE (1) DE2862475D1 (ja)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4201800A (en) * 1978-04-28 1980-05-06 International Business Machines Corp. Hardened photoresist master image mask process
US4314267A (en) * 1978-06-13 1982-02-02 Ibm Corporation Dense high performance JFET compatible with NPN transistor formation and merged BIFET
US4168999A (en) * 1978-12-26 1979-09-25 Fairchild Camera And Instrument Corporation Method for forming oxide isolated integrated injection logic semiconductor structures having minimal encroachment utilizing special masking techniques
US4395812A (en) * 1980-02-04 1983-08-02 Ibm Corporation Forming an integrated circuit
FR2482368A1 (fr) * 1980-05-12 1981-11-13 Thomson Csf Operateur logique a injection par le substrat et son procede de fabrication
US4446611A (en) * 1980-06-26 1984-05-08 International Business Machines Corporation Method of making a saturation-limited bipolar transistor device
US4390890A (en) * 1980-06-26 1983-06-28 International Business Machines Corporation Saturation-limited bipolar transistor device
EP0065463B1 (en) * 1981-05-11 1986-12-17 FAIRCHILD CAMERA & INSTRUMENT CORPORATION Self-aligned lateral transistor and method of manufacture thereof
US4546539A (en) * 1982-12-08 1985-10-15 Harris Corporation I2 L Structure and fabrication process compatible with high voltage bipolar transistors
US4498227A (en) * 1983-07-05 1985-02-12 Fairchild Camera & Instrument Corporation Wafer fabrication by implanting through protective layer
JPS6018299U (ja) * 1983-07-14 1985-02-07 木村工機株式会社 シロツコ型フアンにおける雑音消去装置
US4573256A (en) * 1983-08-26 1986-03-04 International Business Machines Corporation Method for making a high performance transistor integrated circuit
US5067002A (en) * 1987-01-30 1991-11-19 Motorola, Inc. Integrated circuit structures having polycrystalline electrode contacts
US4837176A (en) * 1987-01-30 1989-06-06 Motorola Inc. Integrated circuit structures having polycrystalline electrode contacts and process
JP3024143B2 (ja) * 1989-06-19 2000-03-21 ソニー株式会社 半導体装置の製法
DE69025899T2 (de) * 1989-12-28 1996-09-19 Sanyo Electric Co Verfahren zur Herstellung einer integrierten Halbleiterschaltung
US5128272A (en) * 1991-06-18 1992-07-07 National Semiconductor Corporation Self-aligned planar monolithic integrated circuit vertical transistor process
DE69125390T2 (de) * 1991-07-03 1997-08-28 Cons Ric Microelettronica Laterale Bipolartransistorstruktur mit integriertem Kontrollschaltkreis und integriertem Leistungstransistor und deren Herstellungsprozess
FR2687843A1 (fr) * 1992-02-24 1993-08-27 Motorola Semiconducteurs Transistor bipolaire lateral pnp et procede de fabrication.
US5360750A (en) * 1994-01-13 1994-11-01 United Microelectronics Corp. Method of fabricating lateral bipolar transistors
US5455189A (en) * 1994-02-28 1995-10-03 National Semiconductor Corporation Method of forming BICMOS structures
US5416032A (en) * 1994-06-24 1995-05-16 Sgs-Thomson Microelectronics, Inc. Method of making a high conductivity p-plus region for self-aligned, shallow diffused, bipolar transistors
DE19647554A1 (de) * 1996-11-16 1998-05-28 Daimler Benz Ag Funktionsflüssigkeit für lebensdauergeschmierte Verbrennungsmotoren
SE519628C2 (sv) * 1997-03-04 2003-03-18 Ericsson Telefon Ab L M Tillverkningsförfarande för halvledarkomponent med deponering av selektivt utformat material,vilket är ogenomträngligt för dopjoner
US6506656B2 (en) * 2001-03-19 2003-01-14 International Business Machines Corporation Stepped collector implant and method for fabrication
JP2002324846A (ja) 2001-04-25 2002-11-08 Sanken Electric Co Ltd 半導体装置及びその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3725150A (en) * 1971-10-29 1973-04-03 Motorola Inc Process for making a fine geometry, self-aligned device structure
DE2157633C3 (de) * 1971-11-20 1980-01-24 Deutsche Itt Industries Gmbh, 7800 Freiburg Verfahren zum Herstellen von Zonen einer monolithisch integrierten Festkörperschaltung
JPS5538823B2 (ja) * 1971-12-22 1980-10-07
US3891480A (en) * 1973-10-01 1975-06-24 Honeywell Inc Bipolar semiconductor device construction
US3928081A (en) * 1973-10-26 1975-12-23 Signetics Corp Method for fabricating semiconductor devices using composite mask and ion implantation
US3928082A (en) * 1973-12-28 1975-12-23 Texas Instruments Inc Self-aligned transistor process
US3951693A (en) * 1974-01-17 1976-04-20 Motorola, Inc. Ion-implanted self-aligned transistor device including the fabrication method therefor
US3933528A (en) * 1974-07-02 1976-01-20 Texas Instruments Incorporated Process for fabricating integrated circuits utilizing ion implantation
FR2282162A1 (fr) * 1974-08-12 1976-03-12 Radiotechnique Compelec Procede de realisation de dispositifs semiconducteurs
US3971059A (en) * 1974-09-23 1976-07-20 National Semiconductor Corporation Complementary bipolar transistors having collector diffused isolation
US4046606A (en) * 1976-05-10 1977-09-06 Rca Corporation Simultaneous location of areas having different conductivities
US4021270A (en) * 1976-06-28 1977-05-03 Motorola, Inc. Double master mask process for integrated circuit manufacture
FR2372511A1 (fr) * 1976-11-25 1978-06-23 Comp Generale Electricite Procede de realisation d'emetteurs et de contacts de base sur un semiconducteur planaire

Also Published As

Publication number Publication date
EP0007923A1 (de) 1980-02-20
DE2862475D1 (en) 1986-01-09
EP0007923B1 (de) 1985-11-27
US4110126A (en) 1978-08-29
JPS5437687A (en) 1979-03-20

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