JPS5641375A - Sputtering apparatus - Google Patents
Sputtering apparatusInfo
- Publication number
- JPS5641375A JPS5641375A JP11851779A JP11851779A JPS5641375A JP S5641375 A JPS5641375 A JP S5641375A JP 11851779 A JP11851779 A JP 11851779A JP 11851779 A JP11851779 A JP 11851779A JP S5641375 A JPS5641375 A JP S5641375A
- Authority
- JP
- Japan
- Prior art keywords
- anode
- sputtering apparatus
- coating
- columnar
- globular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/223—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating specially adapted for coating particles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
PURPOSE:To make the coating formation on the columnar or globular material possible, by providing the apparatus giving oscillation or revolution to the electrode having the material which forms the coating, in sputtering apparatus. CONSTITUTION:Uniform coating is formed on curved surface of matrial having not only cylindrical shape but columnar or globular etc. shape. For example, the cathode 7 having the target substance 8 and the anode 9 having the material 10, are provided in the chamber 15. Surface of the anode 9 is surround by the convex part 9a and the material 10 is kept not to fallen down and the anode 9 is connected with the motor 12 through the cum 14 and the rotating shaft 13. Oscillation is given to the anode 9 by the motor 12 at the time of applying the direct current power source 11 and operating the sputtering apparatus. Hereby, the material 10 is moved at random and uniform coating is formed on the surface of the material 10 because of turning all face toward the substance 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11851779A JPS5641375A (en) | 1979-09-13 | 1979-09-13 | Sputtering apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11851779A JPS5641375A (en) | 1979-09-13 | 1979-09-13 | Sputtering apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5641375A true JPS5641375A (en) | 1981-04-18 |
Family
ID=14738578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11851779A Pending JPS5641375A (en) | 1979-09-13 | 1979-09-13 | Sputtering apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5641375A (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58136701A (en) * | 1982-02-08 | 1983-08-13 | Japan Synthetic Rubber Co Ltd | Coating method for fine particles |
| JPS59120531U (en) * | 1983-02-01 | 1984-08-14 | トヨタ自動車株式会社 | Nut automatic tightening device |
| JPS604008A (en) * | 1983-06-23 | 1985-01-10 | アサノ精機株式会社 | Formwork bolt erecting device |
| JPS605805U (en) * | 1983-06-23 | 1985-01-16 | アサノ精機株式会社 | Bolt raising device with oil spray mechanism |
| JPS60104622A (en) * | 1983-06-20 | 1985-06-10 | Shibaura Eng Works Co Ltd | Mobile bolt tightening device |
| JPS63194903A (en) * | 1987-02-09 | 1988-08-12 | 生川コンクリ−ト株式会社 | Automatic clamping method and device for formwork for molding concrete product |
| JPS63194902A (en) * | 1987-02-09 | 1988-08-12 | 生川コンクリ−ト株式会社 | Automatic loosening device for formwork for molding concrete product |
| JPH0726379A (en) * | 1993-07-09 | 1995-01-27 | Koa Corp | Method for formation of thin film and device therefor |
| WO2004059031A1 (en) * | 2002-12-25 | 2004-07-15 | Youtec Co.,Ltd. | Polygonal barrel spattering device, polygonal barrel spattering method, coated particle formed by the device and method, microcapsule, and method of manufacturing the microcapsule |
| JP2008045197A (en) * | 2006-08-21 | 2008-02-28 | Sony Corp | Composite powder manufacturing method and composite powder manufacturing apparatus |
| WO2008119514A1 (en) * | 2007-03-29 | 2008-10-09 | Hauzer Techno Coating Bv | Method and device for coating particularly rounded objects by means of a pvd and/or cvd or pacvd method in a vacuum system |
| US8268080B2 (en) | 2008-03-25 | 2012-09-18 | Sony Corporation | Apparatus and method for preparing composite particulates using vapor deposition |
| JP2016122750A (en) * | 2014-12-25 | 2016-07-07 | 株式会社島津製作所 | Work holder and film forming apparatus |
| WO2016140326A1 (en) * | 2015-03-04 | 2016-09-09 | デクセリアルズ株式会社 | Method for manufacturing conductive particles, anisotropically conductive adhesive, and method for mounting component |
| CN112555112A (en) * | 2020-11-06 | 2021-03-26 | 兰州空间技术物理研究所 | Textured special-shaped structure anode on inner surface of ion thruster based on 3D additive manufacturing |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS515279A (en) * | 1974-05-28 | 1976-01-16 | Corning Glass Works | Fukusunoenchukeibutsutaioitsuseinihifukusuruhohooyobi kaitensupatsutasochi |
| JPS5154844A (en) * | 1974-05-08 | 1976-05-14 | Hokuriku Elect Ind | Kinzokuhakumakuno seizosochi |
| JPS52123362A (en) * | 1976-04-09 | 1977-10-17 | Hokuriku Elect Ind | Device for making thin metal film |
-
1979
- 1979-09-13 JP JP11851779A patent/JPS5641375A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5154844A (en) * | 1974-05-08 | 1976-05-14 | Hokuriku Elect Ind | Kinzokuhakumakuno seizosochi |
| JPS515279A (en) * | 1974-05-28 | 1976-01-16 | Corning Glass Works | Fukusunoenchukeibutsutaioitsuseinihifukusuruhohooyobi kaitensupatsutasochi |
| JPS52123362A (en) * | 1976-04-09 | 1977-10-17 | Hokuriku Elect Ind | Device for making thin metal film |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58136701A (en) * | 1982-02-08 | 1983-08-13 | Japan Synthetic Rubber Co Ltd | Coating method for fine particles |
| JPS59120531U (en) * | 1983-02-01 | 1984-08-14 | トヨタ自動車株式会社 | Nut automatic tightening device |
| JPS60104622A (en) * | 1983-06-20 | 1985-06-10 | Shibaura Eng Works Co Ltd | Mobile bolt tightening device |
| JPS604008A (en) * | 1983-06-23 | 1985-01-10 | アサノ精機株式会社 | Formwork bolt erecting device |
| JPS605805U (en) * | 1983-06-23 | 1985-01-16 | アサノ精機株式会社 | Bolt raising device with oil spray mechanism |
| JPS63194903A (en) * | 1987-02-09 | 1988-08-12 | 生川コンクリ−ト株式会社 | Automatic clamping method and device for formwork for molding concrete product |
| JPS63194902A (en) * | 1987-02-09 | 1988-08-12 | 生川コンクリ−ト株式会社 | Automatic loosening device for formwork for molding concrete product |
| JPH0726379A (en) * | 1993-07-09 | 1995-01-27 | Koa Corp | Method for formation of thin film and device therefor |
| WO2004059031A1 (en) * | 2002-12-25 | 2004-07-15 | Youtec Co.,Ltd. | Polygonal barrel spattering device, polygonal barrel spattering method, coated particle formed by the device and method, microcapsule, and method of manufacturing the microcapsule |
| JP2008045197A (en) * | 2006-08-21 | 2008-02-28 | Sony Corp | Composite powder manufacturing method and composite powder manufacturing apparatus |
| WO2008119514A1 (en) * | 2007-03-29 | 2008-10-09 | Hauzer Techno Coating Bv | Method and device for coating particularly rounded objects by means of a pvd and/or cvd or pacvd method in a vacuum system |
| US8268080B2 (en) | 2008-03-25 | 2012-09-18 | Sony Corporation | Apparatus and method for preparing composite particulates using vapor deposition |
| US8545934B2 (en) | 2008-03-25 | 2013-10-01 | Sony Corporation | Apparatus and method for preparing composite particulates |
| JP2016122750A (en) * | 2014-12-25 | 2016-07-07 | 株式会社島津製作所 | Work holder and film forming apparatus |
| WO2016140326A1 (en) * | 2015-03-04 | 2016-09-09 | デクセリアルズ株式会社 | Method for manufacturing conductive particles, anisotropically conductive adhesive, and method for mounting component |
| CN112555112A (en) * | 2020-11-06 | 2021-03-26 | 兰州空间技术物理研究所 | Textured special-shaped structure anode on inner surface of ion thruster based on 3D additive manufacturing |
| CN112555112B (en) * | 2020-11-06 | 2022-06-14 | 兰州空间技术物理研究所 | Textured special-shaped structure anode on inner surface of ion thruster based on 3D additive manufacturing |
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