JPS564253A - Device for assembling electronic parts - Google Patents

Device for assembling electronic parts

Info

Publication number
JPS564253A
JPS564253A JP7919879A JP7919879A JPS564253A JP S564253 A JPS564253 A JP S564253A JP 7919879 A JP7919879 A JP 7919879A JP 7919879 A JP7919879 A JP 7919879A JP S564253 A JPS564253 A JP S564253A
Authority
JP
Japan
Prior art keywords
base
opening
pellet
guide
moved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7919879A
Other languages
Japanese (ja)
Other versions
JPS6155771B2 (en
Inventor
Toshikazu Oshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7919879A priority Critical patent/JPS564253A/en
Publication of JPS564253A publication Critical patent/JPS564253A/en
Publication of JPS6155771B2 publication Critical patent/JPS6155771B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE:To perform accurate assembly, by using the pellet mounting section of a ceramic package as a positioning reference. CONSTITUTION:When the base 5 of a ceramic package conveyed on a heat block 6 is moved to a pellet mounting section, a cavity guide 1 is inserted into an opening 7 of the top of the base 5 and stopped in a fixed position. The base 5 is thrusted on the guide 1 by claws 3, 2. A thrusting plate 4 is then moved down to secure the base 5 in a prescribed position on the heat block 6 so that the base can be positioned in a direction X on the basis of a line B on an inside wall of te opening 7 and in another direction Y on the basis of another line A on another inside wall of the opening. After that, the guide 1 is moved up. A rectangular collet 8 sucking a semiconductor pellet 9 on the collet itself is operated to attach the pellet to the base 5 at the bottom of the opening 7. As a result, accurate assembly is enabled even if the dimensional accuracy of the package is low.
JP7919879A 1979-06-25 1979-06-25 Device for assembling electronic parts Granted JPS564253A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7919879A JPS564253A (en) 1979-06-25 1979-06-25 Device for assembling electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7919879A JPS564253A (en) 1979-06-25 1979-06-25 Device for assembling electronic parts

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP60134043A Division JPS6116536A (en) 1985-06-21 1985-06-21 Bonding device for pellet
JP22631587A Division JPS6372132A (en) 1987-09-11 1987-09-11 How to attach semiconductor pellets

Publications (2)

Publication Number Publication Date
JPS564253A true JPS564253A (en) 1981-01-17
JPS6155771B2 JPS6155771B2 (en) 1986-11-29

Family

ID=13683262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7919879A Granted JPS564253A (en) 1979-06-25 1979-06-25 Device for assembling electronic parts

Country Status (1)

Country Link
JP (1) JPS564253A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178333A (en) * 1981-04-27 1982-11-02 Hitachi Ltd Pellet bonder
JPS60130130A (en) * 1983-12-19 1985-07-11 Marine Instr Co Ltd Method of die bonding on thermal substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178333A (en) * 1981-04-27 1982-11-02 Hitachi Ltd Pellet bonder
JPS60130130A (en) * 1983-12-19 1985-07-11 Marine Instr Co Ltd Method of die bonding on thermal substrate

Also Published As

Publication number Publication date
JPS6155771B2 (en) 1986-11-29

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