JPS5649207A - Molding die - Google Patents

Molding die

Info

Publication number
JPS5649207A
JPS5649207A JP12378579A JP12378579A JPS5649207A JP S5649207 A JPS5649207 A JP S5649207A JP 12378579 A JP12378579 A JP 12378579A JP 12378579 A JP12378579 A JP 12378579A JP S5649207 A JPS5649207 A JP S5649207A
Authority
JP
Japan
Prior art keywords
cavity
ejector pin
parts
mold
units
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12378579A
Other languages
Japanese (ja)
Inventor
Takeshi Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12378579A priority Critical patent/JPS5649207A/en
Publication of JPS5649207A publication Critical patent/JPS5649207A/en
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE: To reduce the number of parts of the molding die and the number of processing steps and lower the cost of the mold by embedding an ejector pin in a cavity unit, in the mold die provided with a number of cavities.
CONSTITUTION: In a mold provided with cavities 2 corresponding to the outer contour of a molding for an IC element, for example, a runner block 5 is interposed in the intermediate in the longitudinal direction of upper and lower cavity units 3 and 4, and base units 8 and 9 holding the cavity units from both upper and lower sides, are provided. In the lower cavity 4, there is embedded the ejector pin 12 so that it can project into the cavity 2. For this reason, in the case of producing moldings of different kinds, parts to be replaced may be only those held between the upper and lower base units 3 and 4 such as runner block 5, ejector pin 12, ejector pin holder 14, ejector spring 15 and the like, and therefore the number of parts is reduced.
COPYRIGHT: (C)1981,JPO&Japio
JP12378579A 1979-09-28 1979-09-28 Molding die Pending JPS5649207A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12378579A JPS5649207A (en) 1979-09-28 1979-09-28 Molding die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12378579A JPS5649207A (en) 1979-09-28 1979-09-28 Molding die

Publications (1)

Publication Number Publication Date
JPS5649207A true JPS5649207A (en) 1981-05-02

Family

ID=14869231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12378579A Pending JPS5649207A (en) 1979-09-28 1979-09-28 Molding die

Country Status (1)

Country Link
JP (1) JPS5649207A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59207636A (en) * 1983-05-11 1984-11-24 Nec Kyushu Ltd Resin sealing device for semiconductor
JPS61128012U (en) * 1985-01-30 1986-08-11
WO2005023506A1 (en) * 2003-09-03 2005-03-17 Bridgestone Corporation Mold for foam molding, method of manufacturing urethane foam, and urethane foam
JP2016185701A (en) * 2015-03-27 2016-10-27 高槻電器工業株式会社 Die, method for controlling die, and semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5295765A (en) * 1976-02-09 1977-08-11 Hitachi Ltd Mold for forming
JPS5476657A (en) * 1977-12-01 1979-06-19 Asahi Chem Ind Co Ltd Hot-runner mold for injection molding

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5295765A (en) * 1976-02-09 1977-08-11 Hitachi Ltd Mold for forming
JPS5476657A (en) * 1977-12-01 1979-06-19 Asahi Chem Ind Co Ltd Hot-runner mold for injection molding

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59207636A (en) * 1983-05-11 1984-11-24 Nec Kyushu Ltd Resin sealing device for semiconductor
JPS61128012U (en) * 1985-01-30 1986-08-11
WO2005023506A1 (en) * 2003-09-03 2005-03-17 Bridgestone Corporation Mold for foam molding, method of manufacturing urethane foam, and urethane foam
US7575427B2 (en) 2003-09-03 2009-08-18 Bridgestone Corporation Mold for foam molding, method of manufacturing urethane foam, and urethane foam
JP2016185701A (en) * 2015-03-27 2016-10-27 高槻電器工業株式会社 Die, method for controlling die, and semiconductor device

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