JPS575338A - Molding die - Google Patents
Molding dieInfo
- Publication number
- JPS575338A JPS575338A JP7902380A JP7902380A JPS575338A JP S575338 A JPS575338 A JP S575338A JP 7902380 A JP7902380 A JP 7902380A JP 7902380 A JP7902380 A JP 7902380A JP S575338 A JPS575338 A JP S575338A
- Authority
- JP
- Japan
- Prior art keywords
- ejector pin
- resin
- liner
- center
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 title abstract 6
- 239000011347 resin Substances 0.000 abstract 5
- 229920005989 resin Polymers 0.000 abstract 5
- 238000001125 extrusion Methods 0.000 abstract 1
- 230000000717 retained effect Effects 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE:To improve the workability and the automation of a molding die by projecting and removing supplied resin cured in a resin supply passage and a cured molded article by projection ejector pins provided at the center and at both sides of resin molding dies at shared times. CONSTITUTION:Supplied resin clogged in a resin supply passage of a liner 5 of the like is pushed out when molding dies are opened by a liner ejector pin 11 at the center of the lower die base unit 6 and a removing liner ejector pin 21 at the center of an upper molding die mounting unit 13, and a molded article retained in the upper and lower cavities 2, 4 is removed after the dies are opened by an removing cavity ejector pin 20 at both sides of the lower die unit 6 and extrusion cavity ejector pin 15 at both sides of the upper molding unit. Thus, the ejector holder can be only one layer, the workability can be improved, and the space for automation can be secured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7902380A JPS575338A (en) | 1980-06-13 | 1980-06-13 | Molding die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7902380A JPS575338A (en) | 1980-06-13 | 1980-06-13 | Molding die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS575338A true JPS575338A (en) | 1982-01-12 |
Family
ID=13678337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7902380A Pending JPS575338A (en) | 1980-06-13 | 1980-06-13 | Molding die |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS575338A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5926244U (en) * | 1982-08-09 | 1984-02-18 | 坂東 一雄 | Molding equipment for semiconductor resin encapsulation molding |
| JPS59231823A (en) * | 1983-06-13 | 1984-12-26 | Mitsubishi Electric Corp | Resin seal forming device for semiconductor |
| US5480296A (en) * | 1992-02-15 | 1996-01-02 | Goldstar Electron Co., Ltd. | Transfer molding apparatus for encapsulating an electrical element in resin |
| JP2016185701A (en) * | 2015-03-27 | 2016-10-27 | 高槻電器工業株式会社 | Die, method for controlling die, and semiconductor device |
-
1980
- 1980-06-13 JP JP7902380A patent/JPS575338A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5926244U (en) * | 1982-08-09 | 1984-02-18 | 坂東 一雄 | Molding equipment for semiconductor resin encapsulation molding |
| JPS59231823A (en) * | 1983-06-13 | 1984-12-26 | Mitsubishi Electric Corp | Resin seal forming device for semiconductor |
| US5480296A (en) * | 1992-02-15 | 1996-01-02 | Goldstar Electron Co., Ltd. | Transfer molding apparatus for encapsulating an electrical element in resin |
| JP2016185701A (en) * | 2015-03-27 | 2016-10-27 | 高槻電器工業株式会社 | Die, method for controlling die, and semiconductor device |
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