JPS56500112A - - Google Patents

Info

Publication number: JPS56500112A
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP50071380A

Other languages

Japanese (ja)

Other versions

JPS6142430B2 (2

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1979-03-08

Filing date

1980-03-05

Publication date

1981-02-05

1979-03-09 Priority claimed from US06/019,294 external-priority patent/US4257156A/en

1980-03-05 Application filed filed Critical

1981-02-05 Publication of JPS56500112A publication Critical patent/JPS56500112A/ja

1986-09-20 Publication of JPS6142430B2 publication Critical patent/JPS6142430B2/ja

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
- H10W70/22—Conductive package substrates serving as an interconnection, e.g. metal plates having an heterogeneous or anisotropic structure
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07336—Soldering or alloying

Landscapes

Pressure Welding/Diffusion-Bonding (AREA)
Die Bonding (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

JP55500713A 1979-03-08 1980-03-05 Expired JPS6142430B2 (2)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
US1865379A	1979-03-08	1979-03-08
US1922479A	1979-03-09	1979-03-09
US06/019,294 US4257156A (en)	1979-03-09	1979-03-09	Method for thermo-compression diffusion bonding each side of a substrateless semiconductor device wafer to respective structured copper strain buffers

Publications (2)

Publication Number	Publication Date
JPS56500112A true JPS56500112A (2)	1981-02-05
JPS6142430B2 JPS6142430B2 (2)	1986-09-20

Family

ID=27361063

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP55500713A Expired JPS6142430B2 (2)	1979-03-08	1980-03-05

Country Status (4)

Country	Link
EP (1)	EP0025057B1 (2)
JP (1)	JPS6142430B2 (2)
DE (1)	DE3070263D1 (2)
WO (1)	WO1980001967A1 (2)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE19843309A1 (de) *	1998-09-22	2000-03-23	Asea Brown Boveri	Kurzschlussfestes IGBT Modul
EP1246242A1 (de) *	2001-03-26	2002-10-02	Abb Research Ltd.	Kurzschlussfestes IGBT Modul
CN107671412A (zh) *	2012-03-19	2018-02-09	Ev 集团 E·索尔纳有限责任公司	用于对接合压力进行压力传递的压力传递板

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE1153461B (de) *	1960-06-23	1963-08-29	Siemens Ag	Halbleiteranordnung
DE1141029B (de) *	1960-06-23	1962-12-13	Siemens Ag	Halbleiteranordnung und Verfahren zu ihrer Herstellung
US3256598A (en) *	1963-07-25	1966-06-21	Martin Marietta Corp	Diffusion bonding
US3273029A (en) *	1963-08-23	1966-09-13	Hoffman Electronics Corp	Method of attaching leads to a semiconductor body and the article formed thereby
US3295089A (en) *	1963-10-11	1966-12-27	American Mach & Foundry	Semiconductor device
US3237272A (en) *	1965-07-06	1966-03-01	Motorola Inc	Method of making semiconductor device
GB1297046A (2) *	1969-08-25	1972-11-22
US3726466A (en) *	1971-05-28	1973-04-10	Alco Standard Corp	Brazing fixture
US3761783A (en) *	1972-02-02	1973-09-25	Sperry Rand Corp	Duel-mesa ring-shaped high frequency diode
US4071397A (en) *	1973-07-02	1978-01-31	Motorola, Inc.	Silicon metallographic etch
GB1457806A (en) *	1974-03-04	1976-12-08	Mullard Ltd	Semiconductor device manufacture
GB1532628A (en) *	1974-11-15	1978-11-15	Ass Eng Ltd	Metal bonding method
DE2514922C2 (de) *	1975-04-05	1983-01-27	SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg	Gegen thermische Wechselbelastung beständiges Halbleiterbauelement
SU622603A1 (ru) *	1977-04-04	1978-09-05	Предприятие П/Я В-2058	Способ диффузионной сварки
US4089456A (en) *	1977-06-28	1978-05-16	United Technologies Corporation	Controlled-pressure diffusion bonding and fixture therefor
US4385310A (en) *	1978-03-22	1983-05-24	General Electric Company	Structured copper strain buffer
US4392153A (en) *	1978-05-01	1983-07-05	General Electric Company	Cooled semiconductor power module including structured strain buffers without dry interfaces

1980
- 1980-03-05 JP JP55500713A patent/JPS6142430B2/ja not_active Expired
- 1980-03-05 WO PCT/US1980/000220 patent/WO1980001967A1/en not_active Ceased
- 1980-03-05 DE DE8080900618T patent/DE3070263D1/de not_active Expired
- 1980-09-24 EP EP80900618A patent/EP0025057B1/en not_active Expired

Also Published As

Publication number	Publication date
JPS6142430B2 (2)	1986-09-20
WO1980001967A1 (en)	1980-09-18
DE3070263D1 (en)	1985-04-18
EP0025057A1 (en)	1981-03-18
EP0025057A4 (en)	1981-10-27
EP0025057B1 (en)	1985-03-13

Publication	Publication Date	Title
FR2447992B1 (2)	1981-10-16
FR2445755B1 (2)	1982-06-18
FR2446481B1 (2)	1984-04-06
FR2446443B1 (2)	1983-10-28
BR8002583A (2)	1980-12-09
BR8006808A (2)	1981-04-28
FR2449982B1 (2)	1984-06-22
FR2449487B1 (2)	1984-03-23
FR2445775B1 (2)	1983-04-22
FR2446118B3 (2)	1982-02-05
FR2449090B1 (2)	1983-07-29
FR2447388B1 (2)	1983-08-19
FR2449981B1 (2)	1981-06-26
JPS56500112A (2)	1981-02-05
FR2447104B1 (2)	1982-05-21
FR2446826B1 (2)	1981-07-17
FR2445767B1 (2)	1983-06-10
FR2447909B1 (2)	1982-10-29
AU79559S (2)	1981-09-11
AU79200S (2)	1980-09-25
AU79950S (2)	1981-01-30
AU79918S (2)	1981-02-09
BR5901094U (2)	1981-02-17
AU80228S (2)	1980-09-09
BG44800A1 (2)	1989-02-15