JPS5654036A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5654036A JPS5654036A JP13065279A JP13065279A JPS5654036A JP S5654036 A JPS5654036 A JP S5654036A JP 13065279 A JP13065279 A JP 13065279A JP 13065279 A JP13065279 A JP 13065279A JP S5654036 A JPS5654036 A JP S5654036A
- Authority
- JP
- Japan
- Prior art keywords
- film
- poly
- substrate
- impurities
- rediffusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
- H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
- H10P32/14—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Recrystallisation Techniques (AREA)
Abstract
PURPOSE:To conduct diffusion without rediffusion from the semiconductor substrate while changing the quality of a poly Si film and utilize the film as internal wiring by a method wherein laser rays having high output and high energy are irradiated to the poly Si film containing impurities. CONSTITUTION:An SiO2 film 2 on a P type Si substrate 1 is opened, and a poly Si film 3 containing impurities 4 is deposited at the thickness of about several thousand Angstrom . When irradiating the laser rays of several joule/cm<2>, temperature of the poly Si reaches about 1,200 deg.C, the impurities diffuse into the substrate, and a layer 6 is formed. The film 4 often melts, and recrystallizes in an opening portion and is changed into a monocrystal Si film, crystal grains greatly grow portions except the opening portion, impurities caught by crystal grain baundaries are taken into the crystal grains, and resistivity remarkably lowers. Rediffusion from the substrate side is not generated at all because a temperature of the Si substrate hardly rises at that time. Thus, the poly Si film used as a diffusion source can further be utilized as an electrode and internal wiring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13065279A JPS5654036A (en) | 1979-10-08 | 1979-10-08 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13065279A JPS5654036A (en) | 1979-10-08 | 1979-10-08 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5654036A true JPS5654036A (en) | 1981-05-13 |
Family
ID=15039364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13065279A Pending JPS5654036A (en) | 1979-10-08 | 1979-10-08 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5654036A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4947630A (en) * | 1972-06-05 | 1974-05-08 |
-
1979
- 1979-10-08 JP JP13065279A patent/JPS5654036A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4947630A (en) * | 1972-06-05 | 1974-05-08 |
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