JPS5655052A - Mechanical and chemical polishing - Google Patents

Mechanical and chemical polishing

Info

Publication number
JPS5655052A
JPS5655052A JP13113779A JP13113779A JPS5655052A JP S5655052 A JPS5655052 A JP S5655052A JP 13113779 A JP13113779 A JP 13113779A JP 13113779 A JP13113779 A JP 13113779A JP S5655052 A JPS5655052 A JP S5655052A
Authority
JP
Japan
Prior art keywords
wafer
sio2 film
contamination
sio2
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13113779A
Other languages
English (en)
Japanese (ja)
Other versions
JPS641932B2 (fr
Inventor
Toshiro Karaki
Junji Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP13113779A priority Critical patent/JPS5655052A/ja
Publication of JPS5655052A publication Critical patent/JPS5655052A/ja
Publication of JPS641932B2 publication Critical patent/JPS641932B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/126—Preparing bulk and homogeneous wafers by chemical etching

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
JP13113779A 1979-10-11 1979-10-11 Mechanical and chemical polishing Granted JPS5655052A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13113779A JPS5655052A (en) 1979-10-11 1979-10-11 Mechanical and chemical polishing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13113779A JPS5655052A (en) 1979-10-11 1979-10-11 Mechanical and chemical polishing

Publications (2)

Publication Number Publication Date
JPS5655052A true JPS5655052A (en) 1981-05-15
JPS641932B2 JPS641932B2 (fr) 1989-01-13

Family

ID=15050849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13113779A Granted JPS5655052A (en) 1979-10-11 1979-10-11 Mechanical and chemical polishing

Country Status (1)

Country Link
JP (1) JPS5655052A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01125830A (ja) * 1987-11-10 1989-05-18 Naoetsu Denshi Kogyo Kk 半導体ウェーハの研磨方法
EP0986097A3 (fr) * 1998-08-28 2000-05-10 Kabushiki Kaisha Kobe Seiko Sho Procédé de récupération de plaquettes-substrats et solution de polissage pour la récupération de plaquettes-substrats

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5055343A (en) * 1989-05-23 1991-10-08 American Decal & Manufacturing Company Patterned metallized film and method for making same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54110783A (en) * 1978-02-20 1979-08-30 Hitachi Ltd Semiconductor substrate and its manufacture

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54110783A (en) * 1978-02-20 1979-08-30 Hitachi Ltd Semiconductor substrate and its manufacture

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01125830A (ja) * 1987-11-10 1989-05-18 Naoetsu Denshi Kogyo Kk 半導体ウェーハの研磨方法
EP0986097A3 (fr) * 1998-08-28 2000-05-10 Kabushiki Kaisha Kobe Seiko Sho Procédé de récupération de plaquettes-substrats et solution de polissage pour la récupération de plaquettes-substrats

Also Published As

Publication number Publication date
JPS641932B2 (fr) 1989-01-13

Similar Documents

Publication Publication Date Title
SG53191G (en) Film for machining wafers
MY130639A (en) Method of rough polishing semiconductor wafers to reduce surface roughness
JPS6440267A (en) Manufacture of precisely polished glass
DE3063956D1 (en) Process for the chemical etching of silicon substrates
JPS5655052A (en) Mechanical and chemical polishing
US3807979A (en) Quaternary ammonium silicate for polishing silicon metal
FI830919A0 (fi) Behandling av beklaett glas
JPS57170538A (en) Polishing method for one side of semiconductor wafer
BR8104828A (pt) Processo para fabricacao de um copo que compreende um substrato ou um nucleo de um ou mais ceramicas ou carbonetos cementados ,processo para fabricacao de um coprpo revestidodo com oxido de aluminio e corpo revestido
JPS55157472A (en) Sizing method for polishing thin plate parts
JPS561526A (en) Substrate holding jig for substrate treatment
JPS55121643A (en) Fabricating method of semiconductor element
JPS5752137A (en) Bonding method for work in lapping and polishing
JPS51117390A (en) Diamond grindstone for polishing glass
JP3940623B2 (ja) ウェーハ研磨治具とその製造方法及びこれを用いたウェーハ研磨装置
Kasai et al. Progressive mechanical and chemical polishing
JPS5511767A (en) Mirror finishing method of semiconductor wafer
JPS55141571A (en) Surface treatment of perforating steel tool for steel pipe
JPS57149154A (en) Method of polishing semiconductor wafer
ATE112397T1 (de) Vorrichtung zum reinigen von empfindlichen flächen, insbesondere optischen gläsern.
JPS57147241A (en) Bonding method for crystal wafer
JPH0775829B2 (ja) 精密研磨方法
SU1068521A1 (ru) Газораспределительный элемент
JPS5612735A (en) Peeling of monocrystalline wafer
JPS5754069A (en) Precision lapping and polishing method