JPS5655874A - Measuring device for semiconductor - Google Patents
Measuring device for semiconductorInfo
- Publication number
- JPS5655874A JPS5655874A JP13158479A JP13158479A JPS5655874A JP S5655874 A JPS5655874 A JP S5655874A JP 13158479 A JP13158479 A JP 13158479A JP 13158479 A JP13158479 A JP 13158479A JP S5655874 A JPS5655874 A JP S5655874A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- test
- semiconductor element
- measuring
- accordance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 238000010438 heat treatment Methods 0.000 abstract 2
- 239000008188 pellet Substances 0.000 abstract 2
- 238000001816 cooling Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
PURPOSE: To obtain a measuring device which enables highly reliable estimation by a method wherein a heating or cooling device is controlled in accordance with the detected temperature of a measured semiconductor element during the measuring test and thus the initial set temperature is compensated.
CONSTITUTION: With the heating device 7 being controlled in accordance with the set test temperature, the vicinity of the contactor 5 fo a handler 4 is maintained under the temperature near the set temperature. Under the condition, the semiconductor element is inserted into a contactor 5, a series of property-measuring test is performed, and immediately before the completion of the test the consumed current of the pellet within the semiconductor element is measured in the parameter-measuring part of a test station 2. And, the temperature of the pellet is detected from the measured value and, in accordance with the value obtained through comparison of the detected temperature with the set temperature by a comparator, the device 7 is controlled through the intermediary of a system controller 3. By this, the set test temperature is compensated, the semiconductor element is subjected to an ambience test under the prescribed set temperature, and thus the estimation of high reliability can be performed.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13158479A JPS5655874A (en) | 1979-10-12 | 1979-10-12 | Measuring device for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13158479A JPS5655874A (en) | 1979-10-12 | 1979-10-12 | Measuring device for semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5655874A true JPS5655874A (en) | 1981-05-16 |
Family
ID=15061463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13158479A Pending JPS5655874A (en) | 1979-10-12 | 1979-10-12 | Measuring device for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5655874A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5950376A (en) * | 1982-09-14 | 1984-03-23 | Japan Radio Co Ltd | Display device for navigation |
-
1979
- 1979-10-12 JP JP13158479A patent/JPS5655874A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5950376A (en) * | 1982-09-14 | 1984-03-23 | Japan Radio Co Ltd | Display device for navigation |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6593761B1 (en) | Test handler for semiconductor device | |
| JPS5655874A (en) | Measuring device for semiconductor | |
| JPS5251132A (en) | Thermal control unit used for an electronic range | |
| JPS5521158A (en) | Checking method for semiconductor device | |
| JPS5217302A (en) | Automatic probe feeding apparatus for molten metal | |
| JPS5746067A (en) | Glow plug preheating device | |
| JPS5473579A (en) | Testing method of electronic parts | |
| JPS52128071A (en) | Automatic test unit | |
| JPS5949551B2 (en) | Semiconductor device preheating equipment | |
| KR200194289Y1 (en) | Burn-in system in test equipment of semiconductor chip | |
| JPS57124264A (en) | Burn-in testing equipment | |
| JPS5724545A (en) | Measuring method for characteristic of semiconductor wafer | |
| JPS5245379A (en) | Circuit for detecting abnormal rise of temperature | |
| JPS5472983A (en) | Measuring method for semiconductor element | |
| JPS5718210A (en) | Resin molding method for semiconductor device | |
| JPS5255383A (en) | Semiconductor integrated circuit | |
| SU1189888A1 (en) | Method of determining instant of heating-through of solid | |
| JPS5379467A (en) | Reliability testing method for simiconductor device | |
| JPS5763839A (en) | Method and device for judging semiconductor element | |
| JPS5544965A (en) | Testing method of semiconductor device | |
| JPS57153230A (en) | Detecting device for abnormal temperature of gas insulating apparatus | |
| JPS52122455A (en) | Detecting system for contact opening and closing abnormality | |
| JPS5390875A (en) | Test equipment for semiconductor device | |
| JPS53107001A (en) | Automatic testing device for vehicle | |
| JPS5376671A (en) | Semiconductor device |