JPS5658251A - Semiconductor device sealed by glass - Google Patents

Semiconductor device sealed by glass

Info

Publication number
JPS5658251A
JPS5658251A JP13293379A JP13293379A JPS5658251A JP S5658251 A JPS5658251 A JP S5658251A JP 13293379 A JP13293379 A JP 13293379A JP 13293379 A JP13293379 A JP 13293379A JP S5658251 A JPS5658251 A JP S5658251A
Authority
JP
Japan
Prior art keywords
soldered
diameter
electrode members
leads
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13293379A
Other languages
Japanese (ja)
Inventor
Kensuke Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13293379A priority Critical patent/JPS5658251A/en
Publication of JPS5658251A publication Critical patent/JPS5658251A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To sufficiently cut outside air off any soldered section when electrode members holding a semiconductor pellet therebetween is soldered on each end of a pair of leads, by making the diameter of the header section of the heads larger than the diameter of an electrode member to ensure a glass sealing covering the soldered section. CONSTITUTION:Electrode members 3a and 3b made of W, Mo or the like firmly fixing an Si pellets therebetween are arranged with soldering materials 4a and 4b such as Al between a pair of leads with one end thereof formed like a nail head and soldered with the header section of the leads 11 and 11b employing soldering materials 2a and 2b mainly composed of Cu. Here, the diameter of the header section is made larger than the diameter of the electrode members 3a and 3b beforehand so that the electrode members 3a and 3b are sealed with a glass seal 6 including the soldered parts 2a and 2b. This keeps the soldering materials 2a and 2b off outside air thereby improving the corrosion resistance of the device significantly.
JP13293379A 1979-10-17 1979-10-17 Semiconductor device sealed by glass Pending JPS5658251A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13293379A JPS5658251A (en) 1979-10-17 1979-10-17 Semiconductor device sealed by glass

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13293379A JPS5658251A (en) 1979-10-17 1979-10-17 Semiconductor device sealed by glass

Publications (1)

Publication Number Publication Date
JPS5658251A true JPS5658251A (en) 1981-05-21

Family

ID=15092886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13293379A Pending JPS5658251A (en) 1979-10-17 1979-10-17 Semiconductor device sealed by glass

Country Status (1)

Country Link
JP (1) JPS5658251A (en)

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