JPS5660209A - Metal mold device for molding semiconductor element with resin sealing member - Google Patents

Metal mold device for molding semiconductor element with resin sealing member

Info

Publication number
JPS5660209A
JPS5660209A JP13714779A JP13714779A JPS5660209A JP S5660209 A JPS5660209 A JP S5660209A JP 13714779 A JP13714779 A JP 13714779A JP 13714779 A JP13714779 A JP 13714779A JP S5660209 A JPS5660209 A JP S5660209A
Authority
JP
Japan
Prior art keywords
resin
block
bored
spot facing
sealing member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13714779A
Other languages
Japanese (ja)
Other versions
JPS6124971B2 (en
Inventor
Seiji Takemura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13714779A priority Critical patent/JPS5660209A/en
Publication of JPS5660209A publication Critical patent/JPS5660209A/en
Publication of JPS6124971B2 publication Critical patent/JPS6124971B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE:To prevent resin from flowing in a bored spot facing by putting removably a blocking member made of heat-resisting synthetic resin in the bored spot facing for a fitting bolt which fits a cavity block and a center block to a heating block. CONSTITUTION:A lower die part 1 is constituted by fitting the cavity block 2 and the center block 3 to the heating block 4 by the fitting bolt 12. And for this fitting bolt 12, the liquefied heat-resisting resin such as silicone resin is directly injected and set in the bored spot facing 11 formed in the cavity block 2 and the center block 3 to provided the blocking member 20 assuming the rubberlike elasticity and formed removably, whereby the resin which is injected and leaks out and the resin which is removed in cleansing are prevented from flowing in the bored spot facing 11 and also the disassembling of the upper and lower die parts of the mold is facilitated.
JP13714779A 1979-10-23 1979-10-23 Metal mold device for molding semiconductor element with resin sealing member Granted JPS5660209A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13714779A JPS5660209A (en) 1979-10-23 1979-10-23 Metal mold device for molding semiconductor element with resin sealing member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13714779A JPS5660209A (en) 1979-10-23 1979-10-23 Metal mold device for molding semiconductor element with resin sealing member

Publications (2)

Publication Number Publication Date
JPS5660209A true JPS5660209A (en) 1981-05-25
JPS6124971B2 JPS6124971B2 (en) 1986-06-13

Family

ID=15191909

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13714779A Granted JPS5660209A (en) 1979-10-23 1979-10-23 Metal mold device for molding semiconductor element with resin sealing member

Country Status (1)

Country Link
JP (1) JPS5660209A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005123358A1 (en) * 2004-06-21 2005-12-29 Mamada Sangyo Mold, method of manufacturing the same, injection molding device, and injection molding method
JP2006035843A (en) * 2004-06-21 2006-02-09 Mamada Sangyo:Kk Mold and manufacturing method thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4380775B1 (en) 2008-05-29 2009-12-09 トヨタ自動車株式会社 FRP member manufacturing method and FRP member
JP4775411B2 (en) * 2008-06-23 2011-09-21 トヨタ自動車株式会社 Screw hole sealing structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005123358A1 (en) * 2004-06-21 2005-12-29 Mamada Sangyo Mold, method of manufacturing the same, injection molding device, and injection molding method
JP2006035843A (en) * 2004-06-21 2006-02-09 Mamada Sangyo:Kk Mold and manufacturing method thereof
US7497679B2 (en) 2004-06-21 2009-03-03 Mamada Sangyo Injection mold having a switching valve
EP1759823A4 (en) * 2004-06-21 2010-01-27 Mamada Sangyo Mold, method of manufacturing the same, injection molding device, and injection molding method

Also Published As

Publication number Publication date
JPS6124971B2 (en) 1986-06-13

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