JPS5664447A - Resin sealing device for integrated circuit element - Google Patents

Resin sealing device for integrated circuit element

Info

Publication number
JPS5664447A
JPS5664447A JP14063479A JP14063479A JPS5664447A JP S5664447 A JPS5664447 A JP S5664447A JP 14063479 A JP14063479 A JP 14063479A JP 14063479 A JP14063479 A JP 14063479A JP S5664447 A JPS5664447 A JP S5664447A
Authority
JP
Japan
Prior art keywords
mold
product
resin
integrated circuit
sealing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14063479A
Other languages
Japanese (ja)
Inventor
Naoto Kimura
Katsuhiro Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP14063479A priority Critical patent/JPS5664447A/en
Publication of JPS5664447A publication Critical patent/JPS5664447A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C45/1468—Plants therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To form the resin sealing device compact by automatically supplying a lead frame placing integrated circuit elements onto one or two rails, positioning them in the lower die, lowering the upper die, then molding the resin in the mold, moving it on the rails, and separating the product and the unnecessary part from each other. CONSTITUTION:The lead frames 1 are isolated one by one by a stopper 6 from a case 5 and are thus supplied to the mold 8. The case 5 is elevationally driven by a drive unit 17. The frame 1 is set by the stopper 13 at a predetermined position, the upper die 9 is lowered thereby pressurizing the mold. Simultaneously, the resin 12 is charged from a cylinder 11, and the IC element 2 is thus sealed. After sealing, the mold 9 is raised, the product is moved, and the product 3 and the unnecessary part 4 are isolated by the movable cylinder 14 and are respectively contained in boxes 15 and 16, respectively. According to this configuration the device can be reduced in size and the mechanism can be simplified, and accordingly trouble is reduced.
JP14063479A 1979-10-30 1979-10-30 Resin sealing device for integrated circuit element Pending JPS5664447A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14063479A JPS5664447A (en) 1979-10-30 1979-10-30 Resin sealing device for integrated circuit element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14063479A JPS5664447A (en) 1979-10-30 1979-10-30 Resin sealing device for integrated circuit element

Publications (1)

Publication Number Publication Date
JPS5664447A true JPS5664447A (en) 1981-06-01

Family

ID=15273242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14063479A Pending JPS5664447A (en) 1979-10-30 1979-10-30 Resin sealing device for integrated circuit element

Country Status (1)

Country Link
JP (1) JPS5664447A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61210641A (en) * 1985-03-15 1986-09-18 Sony Corp Manufacture apparatus for semiconductor part
JPS61210640A (en) * 1985-03-15 1986-09-18 Sony Corp Manufacturing apparatus for semiconductor part

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5456657A (en) * 1977-10-14 1979-05-07 Iwatani & Co Transfer mold press

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5456657A (en) * 1977-10-14 1979-05-07 Iwatani & Co Transfer mold press

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61210641A (en) * 1985-03-15 1986-09-18 Sony Corp Manufacture apparatus for semiconductor part
JPS61210640A (en) * 1985-03-15 1986-09-18 Sony Corp Manufacturing apparatus for semiconductor part

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