JPS5763834A - Frame carrying apparatus for semiconductor device - Google Patents

Frame carrying apparatus for semiconductor device

Info

Publication number
JPS5763834A
JPS5763834A JP55139486A JP13948680A JPS5763834A JP S5763834 A JPS5763834 A JP S5763834A JP 55139486 A JP55139486 A JP 55139486A JP 13948680 A JP13948680 A JP 13948680A JP S5763834 A JPS5763834 A JP S5763834A
Authority
JP
Japan
Prior art keywords
frame
press
lead frames
slack
transferred
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55139486A
Other languages
Japanese (ja)
Other versions
JPH0212020B2 (en
Inventor
Koji Yanagiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP55139486A priority Critical patent/JPS5763834A/en
Publication of JPS5763834A publication Critical patent/JPS5763834A/en
Publication of JPH0212020B2 publication Critical patent/JPH0212020B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent breakage of bonding wire and the like due to the slack of the wire, in the case lead frames having semiconductor chips are transferred to a metal mold press for resin sealing and automatically loaded, by holding both sides of the lead frames. CONSTITUTION:The lead frames wherein the semiconductor chips are attached are loaded in a magazine 7 and enclosed in a container 8. The lead frame is inserted between movable rails 24 and 25 of a moving plate 23 for transferring the frame to the molding press 15 by a loader (not shown). The movable rails 24 and 25 are rotated right and left, receive the frame, and hold it at accurate locations by positioning pins. The frame is transferred to the molding press 15, fixxed to accurate locations by positioning pins on the press, and a resin molding precoss is performed. Since the frame is held by the moving plate 23, the slack is not caused, the breakage of the bonding wire is not caused, and the accurate loading can be performed.
JP55139486A 1980-10-03 1980-10-03 Frame carrying apparatus for semiconductor device Granted JPS5763834A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55139486A JPS5763834A (en) 1980-10-03 1980-10-03 Frame carrying apparatus for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55139486A JPS5763834A (en) 1980-10-03 1980-10-03 Frame carrying apparatus for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5763834A true JPS5763834A (en) 1982-04-17
JPH0212020B2 JPH0212020B2 (en) 1990-03-16

Family

ID=15246366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55139486A Granted JPS5763834A (en) 1980-10-03 1980-10-03 Frame carrying apparatus for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5763834A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61501535A (en) * 1984-03-22 1986-07-24 モステック・コ−ポレイション Gripping device for integrated circuit lead frames
JPS61166136A (en) * 1985-01-18 1986-07-26 Toshiba Mach Co Ltd Intermediate frame holder

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61501535A (en) * 1984-03-22 1986-07-24 モステック・コ−ポレイション Gripping device for integrated circuit lead frames
JPS61166136A (en) * 1985-01-18 1986-07-26 Toshiba Mach Co Ltd Intermediate frame holder

Also Published As

Publication number Publication date
JPH0212020B2 (en) 1990-03-16

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