JPS5666049A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5666049A
JPS5666049A JP14675380A JP14675380A JPS5666049A JP S5666049 A JPS5666049 A JP S5666049A JP 14675380 A JP14675380 A JP 14675380A JP 14675380 A JP14675380 A JP 14675380A JP S5666049 A JPS5666049 A JP S5666049A
Authority
JP
Japan
Prior art keywords
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14675380A
Other languages
English (en)
Inventor
Baaringaa Buarutaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of JPS5666049A publication Critical patent/JPS5666049A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Die Bonding (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
JP14675380A 1979-10-19 1980-10-20 Semiconductor device Pending JPS5666049A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19792942409 DE2942409A1 (de) 1979-10-19 1979-10-19 Halbleiterbauelement mit mehreren halbleiterkoerpern

Publications (1)

Publication Number Publication Date
JPS5666049A true JPS5666049A (en) 1981-06-04

Family

ID=6083930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14675380A Pending JPS5666049A (en) 1979-10-19 1980-10-20 Semiconductor device

Country Status (3)

Country Link
US (1) US4390891A (ja)
JP (1) JPS5666049A (ja)
DE (1) DE2942409A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6074461A (ja) * 1983-09-29 1985-04-26 Toshiba Corp 半導体装置
JPS6074462A (ja) * 1983-09-29 1985-04-26 Toshiba Corp 半導体装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4568962A (en) * 1982-11-08 1986-02-04 Motorola, Inc. Plastic encapsulated semiconductor power device means and method
DE3486256T2 (de) * 1983-09-29 1994-05-11 Toshiba Kawasaki Kk Halbleiteranordnung in Druckpackung.
DE3345285A1 (de) * 1983-12-14 1985-06-27 Siemens AG, 1000 Berlin und 8000 München Leistungs-halbleiteranordnung
US4614964A (en) * 1984-08-15 1986-09-30 Sundstrand Corporation Coaxial semiconductor package
US4954876A (en) * 1988-08-01 1990-09-04 Sundstrand Corporation Hermetically sealed compression bonded circuit assembly having flexible walls at points of application of pressure for compression bonding circuit elements
US5034803A (en) * 1988-08-01 1991-07-23 Sundstrand Corporation Compression bonded semiconductor device having a plurality of stacked hermetically sealed circuit assemblies
US4830979A (en) * 1988-08-01 1989-05-16 Sundstrand Corp. Method of manufacturing hermetically sealed compression bonded circuit assemblies
US4985752A (en) * 1988-08-01 1991-01-15 Sundstrand Corporation Hermetically sealed compression bonded circuit assembly having a suspension for compression bonded semiconductor elements
DE102006006424B4 (de) * 2006-02-13 2011-11-17 Semikron Elektronik Gmbh & Co. Kg Anordnung mit mindestens einem Leistungshalbleitermodul und einem Kühlbauteil und zugehöriges Herstellungsverfahren
DE102011075515B4 (de) * 2011-05-09 2015-01-08 Infineon Technologies Bipolar Gmbh & Co. Kg Verbessertes Leistungshalbleiterbauelementmodul
CN208093538U (zh) * 2015-08-25 2018-11-13 英飞凌科技有限两合公司 具有构成盆体的压力板的功率半导体组件模块

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5410672A (en) * 1977-06-23 1979-01-26 Siemens Ag Semiconductor
JPS5410673A (en) * 1977-06-24 1979-01-26 Siemens Ag Semiconductor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4106052A (en) * 1975-04-19 1978-08-08 Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. Semiconductor rectifier unit having a base plate with means for maintaining insulating wafers in a desired position

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5410672A (en) * 1977-06-23 1979-01-26 Siemens Ag Semiconductor
JPS5410673A (en) * 1977-06-24 1979-01-26 Siemens Ag Semiconductor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6074461A (ja) * 1983-09-29 1985-04-26 Toshiba Corp 半導体装置
JPS6074462A (ja) * 1983-09-29 1985-04-26 Toshiba Corp 半導体装置

Also Published As

Publication number Publication date
DE2942409A1 (de) 1981-04-23
US4390891A (en) 1983-06-28

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