JPS5667926A - Processing method - Google Patents

Processing method

Info

Publication number
JPS5667926A
JPS5667926A JP14384379A JP14384379A JPS5667926A JP S5667926 A JPS5667926 A JP S5667926A JP 14384379 A JP14384379 A JP 14384379A JP 14384379 A JP14384379 A JP 14384379A JP S5667926 A JPS5667926 A JP S5667926A
Authority
JP
Japan
Prior art keywords
fluid
rotation center
rotation
nozzle
ejection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14384379A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5756208B2 (it
Inventor
Keiichi Shibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP14384379A priority Critical patent/JPS5667926A/ja
Publication of JPS5667926A publication Critical patent/JPS5667926A/ja
Publication of JPS5756208B2 publication Critical patent/JPS5756208B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
JP14384379A 1979-11-08 1979-11-08 Processing method Granted JPS5667926A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14384379A JPS5667926A (en) 1979-11-08 1979-11-08 Processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14384379A JPS5667926A (en) 1979-11-08 1979-11-08 Processing method

Publications (2)

Publication Number Publication Date
JPS5667926A true JPS5667926A (en) 1981-06-08
JPS5756208B2 JPS5756208B2 (it) 1982-11-29

Family

ID=15348233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14384379A Granted JPS5667926A (en) 1979-11-08 1979-11-08 Processing method

Country Status (1)

Country Link
JP (1) JPS5667926A (it)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011181644A (ja) * 2010-03-01 2011-09-15 Ebara Corp 基板洗浄方法及び基板洗浄装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0439514U (it) * 1990-07-19 1992-04-03

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011181644A (ja) * 2010-03-01 2011-09-15 Ebara Corp 基板洗浄方法及び基板洗浄装置

Also Published As

Publication number Publication date
JPS5756208B2 (it) 1982-11-29

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