JPS5672176A - Production of saw - Google Patents
Production of sawInfo
- Publication number
- JPS5672176A JPS5672176A JP14872879A JP14872879A JPS5672176A JP S5672176 A JPS5672176 A JP S5672176A JP 14872879 A JP14872879 A JP 14872879A JP 14872879 A JP14872879 A JP 14872879A JP S5672176 A JPS5672176 A JP S5672176A
- Authority
- JP
- Japan
- Prior art keywords
- saw
- teeth
- mask
- corrosion
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 abstract 5
- 238000005260 corrosion Methods 0.000 abstract 3
- 230000007797 corrosion Effects 0.000 abstract 3
- 239000000463 material Substances 0.000 abstract 3
- 230000001419 dependent effect Effects 0.000 abstract 1
- 239000003504 photosensitizing agent Substances 0.000 abstract 1
- 238000002791 soaking Methods 0.000 abstract 1
- 239000007921 spray Substances 0.000 abstract 1
Landscapes
- ing And Chemical Polishing (AREA)
Abstract
PURPOSE: To make cheap mass production of saws possible, by forming a mask of the form of saw teeth on both faces of the saw material plat by photographic technique and so on and by stamping out a saw by corrosion and by forming saw teeth and by forming upper edges by post-working.
CONSTITUTION: Outline cut line 4 of a saw and surface negative film1 and reverse face negative film 2 for valleys of teeth are matched to one another by matching holes 3 and are pressure-fixed onto both faces of the material plate of the saw to which a photosensitizer is applied. Next, after exposure, they are developed by the spool method, the soaking method, and so on to form a mask of the saw on the saw material plate. Then, the saw is stamped out along outline cut line 4 and valleys of saw teeth 5 by corrosion according to corrosion technique dependent upon the spray method and so on. After cut edges 6 and back edges 7 of saw teeth 5 are finish-ground as required, the mask is exfoliated, and further, upper edges 8 are formed by post-working, thereby completing production of the saw.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14872879A JPS5672176A (en) | 1979-11-15 | 1979-11-15 | Production of saw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14872879A JPS5672176A (en) | 1979-11-15 | 1979-11-15 | Production of saw |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5672176A true JPS5672176A (en) | 1981-06-16 |
Family
ID=15459276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14872879A Pending JPS5672176A (en) | 1979-11-15 | 1979-11-15 | Production of saw |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5672176A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5422187A (en) * | 1977-07-20 | 1979-02-19 | Tdk Corp | Photoelectric converting device |
-
1979
- 1979-11-15 JP JP14872879A patent/JPS5672176A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5422187A (en) * | 1977-07-20 | 1979-02-19 | Tdk Corp | Photoelectric converting device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5226171A (en) | Mask creation method | |
| JPS5339075A (en) | Step and repeat exposure method of masks | |
| JPS5672176A (en) | Production of saw | |
| JPS5321576A (en) | Mask for x-ray exposure | |
| JPS5354239A (en) | Method of bonding photosensitive flexographic plate and rubber backingmaterial | |
| JPS51140560A (en) | Method of monitoring homoepitaxy film thickness | |
| JPS53128278A (en) | Production of lsi mask | |
| JPS6488546A (en) | Method for exposing thick film resist | |
| JPS52143772A (en) | Alignment method of masks using special reference marks | |
| JPS5394878A (en) | Mask matching key | |
| JPS5388728A (en) | Method of forming pattern | |
| JPS53135578A (en) | Mark protection method | |
| JPS5348458A (en) | Production of semiconductor device | |
| JPS5381079A (en) | Mask forming method | |
| JPS5380994A (en) | Lift-off method | |
| JPS52152171A (en) | Wafer alignment method | |
| JPS53105982A (en) | Micropattern formation method | |
| JPS5376972A (en) | Treating method for waste solution from magnetic tape manufacture | |
| JPS5384465A (en) | Manufacture of semiconductor device | |
| JPS5437579A (en) | Chrome plate | |
| JPS5396678A (en) | Method and apparatus for mask pattern exposure | |
| JPS53135844A (en) | Photochemical etching procee | |
| JPS52111382A (en) | Photo-mask producing for semi-conductor | |
| JPS53112673A (en) | Mask alignment method in semiconductor device manufacturing process and photo mask used for its execution | |
| JPS51124380A (en) | Photo mask |