JPS5678148A - Resistance temperature compensation circuit - Google Patents

Resistance temperature compensation circuit

Info

Publication number
JPS5678148A
JPS5678148A JP15436979A JP15436979A JPS5678148A JP S5678148 A JPS5678148 A JP S5678148A JP 15436979 A JP15436979 A JP 15436979A JP 15436979 A JP15436979 A JP 15436979A JP S5678148 A JPS5678148 A JP S5678148A
Authority
JP
Japan
Prior art keywords
resistance
film
wirings
wiring
insulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15436979A
Other languages
Japanese (ja)
Inventor
Tetsuo Sasaya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15436979A priority Critical patent/JPS5678148A/en
Publication of JPS5678148A publication Critical patent/JPS5678148A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
    • H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To miniaturize a device, by a method wherein, when a No.1 and a No.2 resistance formed with a thick or thin film is formed on an insulation substance to form a resin temperature circuit, said resistances are formed in a two-layer structure such that they are thermally coupled together and electrically separated from each other. CONSTITUTION:Wirings 2-4 for resistance terminal, consisting of a conductor film, are formed on a ceramic substrate 1 at intervals to produce a given pattern, and a No.1 resistance R1 is adhered between the wirings 2 and 3 with the ends of the resistance laid at the surface ends of the wirings 2 and 3. The resistance R1 is covered with an insulation film 5, and a No.2 resistance R2, which ranges from the surface end of the wiring 2 to the end of the other wiring 4, is adhered onto the insulation film 5. If the resistance is a thin film, it is formed through the evaporation of an NiCr alloy, and in the case of the thick film, it is formed through the printing of paste, such a PdAg. This permits corresponding of a circuit to a sever wet property, and allows the reduction in an occupation area.
JP15436979A 1979-11-30 1979-11-30 Resistance temperature compensation circuit Pending JPS5678148A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15436979A JPS5678148A (en) 1979-11-30 1979-11-30 Resistance temperature compensation circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15436979A JPS5678148A (en) 1979-11-30 1979-11-30 Resistance temperature compensation circuit

Publications (1)

Publication Number Publication Date
JPS5678148A true JPS5678148A (en) 1981-06-26

Family

ID=15582647

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15436979A Pending JPS5678148A (en) 1979-11-30 1979-11-30 Resistance temperature compensation circuit

Country Status (1)

Country Link
JP (1) JPS5678148A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5817402A (en) * 1994-07-29 1998-10-06 Sekisui Kagaku Kogyo Kabushiki Kaisha Covering sheet having minute unevenness on the surface thereof, methods of producing said sheet and a molding using said sheet
US5997675A (en) * 1994-07-29 1999-12-07 Sekisui Kagaku Kogyo Kabushiki Kaisha Method of molding using a covering sheet having minute unevenness on the surface thereof
US6419778B2 (en) 1996-05-23 2002-07-16 Sekisui Kagaku Kogyo Kabushiki Kaisha Covering sheet having minute unevenness on the surface thereof, methods of producing said sheet and a molding using said sheet
JP2002539634A (en) * 1999-03-16 2002-11-19 モトローラ・インコーポレイテッド Printed wiring board having multilayer integrated thin film metal resistor and method of manufacturing the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5817402A (en) * 1994-07-29 1998-10-06 Sekisui Kagaku Kogyo Kabushiki Kaisha Covering sheet having minute unevenness on the surface thereof, methods of producing said sheet and a molding using said sheet
US5997675A (en) * 1994-07-29 1999-12-07 Sekisui Kagaku Kogyo Kabushiki Kaisha Method of molding using a covering sheet having minute unevenness on the surface thereof
US6419778B2 (en) 1996-05-23 2002-07-16 Sekisui Kagaku Kogyo Kabushiki Kaisha Covering sheet having minute unevenness on the surface thereof, methods of producing said sheet and a molding using said sheet
JP2002539634A (en) * 1999-03-16 2002-11-19 モトローラ・インコーポレイテッド Printed wiring board having multilayer integrated thin film metal resistor and method of manufacturing the same
EP1082732A4 (en) * 1999-03-16 2006-11-22 Motorola Inc Printed circuit board with a multilayer integral thin-film metal resistor and method therefor

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