JPS5687335A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS5687335A
JPS5687335A JP16526079A JP16526079A JPS5687335A JP S5687335 A JPS5687335 A JP S5687335A JP 16526079 A JP16526079 A JP 16526079A JP 16526079 A JP16526079 A JP 16526079A JP S5687335 A JPS5687335 A JP S5687335A
Authority
JP
Japan
Prior art keywords
wire
cut down
lever
cutting
bent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16526079A
Other languages
Japanese (ja)
Other versions
JPS6026300B2 (en
Inventor
Nobuhito Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP54165260A priority Critical patent/JPS6026300B2/en
Publication of JPS5687335A publication Critical patent/JPS5687335A/en
Publication of JPS6026300B2 publication Critical patent/JPS6026300B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To easily enable a thick wire used to be cut down by providing a mechanism where the wire is bent at a bonding point in cutting the wire. CONSTITUTION:A wire clamper rocking lever 41 is turned round by a given angle counterclockwise by means of a cam 40 for bending the wire, whereby a long groove 41a formed in the lever 41 is engaged with a pin 45 to turn round a wire clamper 20 clockwise and the wire is bent at the base of a tool. In this condition, the first wire cutting lever 25 is turned round counterclockwise by a cam 24 for wire cutting down and the second wire cutting lever 29 is turned round clockwise. By this, the wire clamper 20 is alienated from the tool 11 with the wire 4 remaining held thereby and as a result, the wire 4 is cut down at the bonding unit. Thus, the wire is bent and cut down at the root of the tool 11, so that even a thick wire can easily be cut down.
JP54165260A 1979-12-18 1979-12-18 wire bonding equipment Expired JPS6026300B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54165260A JPS6026300B2 (en) 1979-12-18 1979-12-18 wire bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54165260A JPS6026300B2 (en) 1979-12-18 1979-12-18 wire bonding equipment

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP59059366A Division JPS59181546A (en) 1984-03-29 1984-03-29 Wire bonding method

Publications (2)

Publication Number Publication Date
JPS5687335A true JPS5687335A (en) 1981-07-15
JPS6026300B2 JPS6026300B2 (en) 1985-06-22

Family

ID=15808937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54165260A Expired JPS6026300B2 (en) 1979-12-18 1979-12-18 wire bonding equipment

Country Status (1)

Country Link
JP (1) JPS6026300B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0244740A (en) * 1988-08-05 1990-02-14 Marine Instr Co Ltd Method and apparatus for wire bonding
CN112050848A (en) * 2020-09-09 2020-12-08 合肥矽格玛应用材料有限公司 A device for detecting bond wire bite
US20220013491A1 (en) * 2020-07-10 2022-01-13 Samsung Electronics Co., Ltd. Wire bonding apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62117299U (en) * 1986-01-18 1987-07-25

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0244740A (en) * 1988-08-05 1990-02-14 Marine Instr Co Ltd Method and apparatus for wire bonding
US20220013491A1 (en) * 2020-07-10 2022-01-13 Samsung Electronics Co., Ltd. Wire bonding apparatus
US11521949B2 (en) * 2020-07-10 2022-12-06 Samsung Electronics Co., Ltd. Wire bonding apparatus
US12057428B2 (en) 2020-07-10 2024-08-06 Samsung Electronics Co., Ltd. Wire bonding apparatus
CN112050848A (en) * 2020-09-09 2020-12-08 合肥矽格玛应用材料有限公司 A device for detecting bond wire bite

Also Published As

Publication number Publication date
JPS6026300B2 (en) 1985-06-22

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