JPS5691438A - Method for bonding pellet - Google Patents

Method for bonding pellet

Info

Publication number
JPS5691438A
JPS5691438A JP16835879A JP16835879A JPS5691438A JP S5691438 A JPS5691438 A JP S5691438A JP 16835879 A JP16835879 A JP 16835879A JP 16835879 A JP16835879 A JP 16835879A JP S5691438 A JPS5691438 A JP S5691438A
Authority
JP
Japan
Prior art keywords
scrubbing
amount
bonding
pellet
collet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16835879A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6257096B2 (fr
Inventor
Kazuo Kudo
Shigetaka Kawai
Susumu Iizaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Hitachi Iruma Electronic Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Tohbu Semiconductor Ltd
Hitachi Iruma Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Tohbu Semiconductor Ltd, Hitachi Iruma Electronic Co Ltd filed Critical Hitachi Ltd
Priority to JP16835879A priority Critical patent/JPS5691438A/ja
Publication of JPS5691438A publication Critical patent/JPS5691438A/ja
Publication of JPS6257096B2 publication Critical patent/JPS6257096B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
JP16835879A 1979-12-26 1979-12-26 Method for bonding pellet Granted JPS5691438A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16835879A JPS5691438A (en) 1979-12-26 1979-12-26 Method for bonding pellet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16835879A JPS5691438A (en) 1979-12-26 1979-12-26 Method for bonding pellet

Publications (2)

Publication Number Publication Date
JPS5691438A true JPS5691438A (en) 1981-07-24
JPS6257096B2 JPS6257096B2 (fr) 1987-11-30

Family

ID=15866588

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16835879A Granted JPS5691438A (en) 1979-12-26 1979-12-26 Method for bonding pellet

Country Status (1)

Country Link
JP (1) JPS5691438A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5896739A (ja) * 1981-12-04 1983-06-08 Toshiba Seiki Kk 半導体ペレツトのハイプリツドボンデイング方法
JPS62162335A (ja) * 1986-11-07 1987-07-18 Toshiba Seiki Kk 半導体ペレツトのボンデイング装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA3043583A1 (fr) * 2016-11-11 2018-05-17 Carrier Corporation Detection reposant sur des fibres optiques a haute sensibilite

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52143946A (en) * 1976-05-26 1977-11-30 Hitachi Ltd Mechanism for elevationally moving bonding arm
JPS5513964U (fr) * 1978-07-10 1980-01-29

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52143946A (en) * 1976-05-26 1977-11-30 Hitachi Ltd Mechanism for elevationally moving bonding arm
JPS5513964U (fr) * 1978-07-10 1980-01-29

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5896739A (ja) * 1981-12-04 1983-06-08 Toshiba Seiki Kk 半導体ペレツトのハイプリツドボンデイング方法
JPS62162335A (ja) * 1986-11-07 1987-07-18 Toshiba Seiki Kk 半導体ペレツトのボンデイング装置

Also Published As

Publication number Publication date
JPS6257096B2 (fr) 1987-11-30

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