JPS5693766A - Coating resin composition - Google Patents

Coating resin composition

Info

Publication number
JPS5693766A
JPS5693766A JP17100579A JP17100579A JPS5693766A JP S5693766 A JPS5693766 A JP S5693766A JP 17100579 A JP17100579 A JP 17100579A JP 17100579 A JP17100579 A JP 17100579A JP S5693766 A JPS5693766 A JP S5693766A
Authority
JP
Japan
Prior art keywords
compound
methyl
formula
titanol
ethyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17100579A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6346576B2 (2
Inventor
Shiro Takeda
Minoru Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP17100579A priority Critical patent/JPS5693766A/ja
Priority to US06/161,561 priority patent/US4349609A/en
Priority to DE8080302103T priority patent/DE3065150D1/de
Priority to EP80302103A priority patent/EP0021818B1/en
Publication of JPS5693766A publication Critical patent/JPS5693766A/ja
Publication of JPS6346576B2 publication Critical patent/JPS6346576B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
JP17100579A 1979-06-21 1979-12-28 Coating resin composition Granted JPS5693766A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP17100579A JPS5693766A (en) 1979-12-28 1979-12-28 Coating resin composition
US06/161,561 US4349609A (en) 1979-06-21 1980-06-20 Electronic device having multilayer wiring structure
DE8080302103T DE3065150D1 (en) 1979-06-21 1980-06-23 Improved electronic device having multilayer wiring structure
EP80302103A EP0021818B1 (en) 1979-06-21 1980-06-23 Improved electronic device having multilayer wiring structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17100579A JPS5693766A (en) 1979-12-28 1979-12-28 Coating resin composition

Publications (2)

Publication Number Publication Date
JPS5693766A true JPS5693766A (en) 1981-07-29
JPS6346576B2 JPS6346576B2 (2) 1988-09-16

Family

ID=15915331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17100579A Granted JPS5693766A (en) 1979-06-21 1979-12-28 Coating resin composition

Country Status (1)

Country Link
JP (1) JPS5693766A (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59109565A (ja) * 1982-12-16 1984-06-25 Fujitsu Ltd コ−テイング樹脂溶液およびその製造方法
JPS60199056A (ja) * 1984-03-23 1985-10-08 Dainippon Ink & Chem Inc 高耐熱性樹脂組成物
JPS6125141A (ja) * 1984-07-16 1986-02-04 Tokyo Denshi Kagaku Kabushiki パターン形成方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826822A (2) * 1971-08-11 1973-04-09
JPS4878325A (2) * 1972-01-28 1973-10-20
JPS4881928A (2) * 1972-02-05 1973-11-01

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826822A (2) * 1971-08-11 1973-04-09
JPS4878325A (2) * 1972-01-28 1973-10-20
JPS4881928A (2) * 1972-02-05 1973-11-01

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59109565A (ja) * 1982-12-16 1984-06-25 Fujitsu Ltd コ−テイング樹脂溶液およびその製造方法
JPS60199056A (ja) * 1984-03-23 1985-10-08 Dainippon Ink & Chem Inc 高耐熱性樹脂組成物
JPS6125141A (ja) * 1984-07-16 1986-02-04 Tokyo Denshi Kagaku Kabushiki パターン形成方法

Also Published As

Publication number Publication date
JPS6346576B2 (2) 1988-09-16

Similar Documents

Publication Publication Date Title
JPS55110166A (en) Coating composition
CA2010969A1 (en) Organosilane coating compositions
JPS5536216A (en) Curing of organoalkoxysilane compound
JPS5690862A (en) Fluoroplastic undercoating composition
JPS57128755A (en) Coating composition and preparation of synthetic resin molded article using said composition
JPS5693766A (en) Coating resin composition
JPS56125446A (en) Resin solution
JPS5767635A (en) Dyed article having improved abrasion resistance
JPS51148749A (en) Silicone resin composition
JPS56106969A (en) Transparent abrasion-resistant coating composition
JPS56157429A (en) Resin composition
JPS5681333A (en) Epoxy resin composition
JPS5738864A (en) Preparation of coating composition
JPS53140973A (en) Forming method of semiconductor insulation film
JPS5569102A (en) Optical parts
JPS5573875A (en) Excellently workable mn-plated steel material having pretreatment layer for painting
JPS6416868A (en) Production of molecular composite material of zirconium-containing organosiloxane composition
JPS5610521A (en) Primer for polyester film
JPS56100676A (en) Fluorine-base resin coating method
JPS55130841A (en) Increasing method of adhesive strength between photoresist film and glass
JPS57185357A (en) Composition for making film waterproof
JPS5322598A (en) Aqueous epoxy resin composition using chelate-forming curing agent
JPS54103433A (en) Vibration insulation
JPS5761020A (en) Curing agent for epoxy resin
JPS53140332A (en) Film-forming