JPS57100128A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS57100128A
JPS57100128A JP17610780A JP17610780A JPS57100128A JP S57100128 A JPS57100128 A JP S57100128A JP 17610780 A JP17610780 A JP 17610780A JP 17610780 A JP17610780 A JP 17610780A JP S57100128 A JPS57100128 A JP S57100128A
Authority
JP
Japan
Prior art keywords
epoxy resin
pref
compounding
resin composition
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17610780A
Other languages
Japanese (ja)
Other versions
JPS6154326B2 (en
Inventor
Masahiro Matsumura
Masaaki Otsu
Yoshihiro Kitsuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP17610780A priority Critical patent/JPS57100128A/en
Publication of JPS57100128A publication Critical patent/JPS57100128A/en
Publication of JPS6154326B2 publication Critical patent/JPS6154326B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To prepare the titled composition exhibiting excellent fluidity under low pressure, and suitable for the sealing of a semiconductor device, by compounding a polyfunctional epoxy resin, a novolak compound as a curing agent, and 2-methyl-imidazole.pyromellitic anhydride salt as a cure accelerator.
CONSTITUTION: The objective epoxy resin composition having high rate of cure and excellent storage stability is obtained by compounding (A) 100pts.wt. of a polyfunctional epoxy resin (e.g. bisphenol-type epoxy resin, etc.) with (B) pref. 10W100pts.wt. of a novolak compound (e.g. obtained by reacting a phenol such as cresol with an aldehyde such as formaldehyde in the presence of an acidic catalyst), as a curing agent (C) pref. 1W10pts.wt. of 2-methylimidazole.pyromellitic anhydride salt as a cure accelerator, and pref. (D) a filler such as silica, calcium carbonate, etc.
COPYRIGHT: (C)1982,JPO&Japio
JP17610780A 1980-12-13 1980-12-13 Epoxy resin composition Granted JPS57100128A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17610780A JPS57100128A (en) 1980-12-13 1980-12-13 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17610780A JPS57100128A (en) 1980-12-13 1980-12-13 Epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS57100128A true JPS57100128A (en) 1982-06-22
JPS6154326B2 JPS6154326B2 (en) 1986-11-21

Family

ID=16007808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17610780A Granted JPS57100128A (en) 1980-12-13 1980-12-13 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS57100128A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61501212A (en) * 1984-07-17 1986-06-19 ザ　ダウ　ケミカル　カンパニ− Manufacturing method of partially advanced epoxy resin
JPS63248824A (en) * 1987-04-03 1988-10-17 Shin Etsu Chem Co Ltd epoxy resin composition
US6084037A (en) * 1996-12-19 2000-07-04 Shin -Etsu Chemical Co., Ltd. Epoxy resin composition and semiconductor device
JP2018062570A (en) * 2016-10-13 2018-04-19 三菱瓦斯化学株式会社 Resin composition, resin sheet, printed wiring board, and semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3493630A (en) * 1964-09-22 1970-02-03 Union Carbide Corp Epoxy resins cured with phenolic novolacs and imidazoles
US3746686A (en) * 1971-07-12 1973-07-17 Shell Oil Co Process for curing polyepoxides with polycarboxylic acid salts of an imidazole compound and compositions thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3493630A (en) * 1964-09-22 1970-02-03 Union Carbide Corp Epoxy resins cured with phenolic novolacs and imidazoles
US3746686A (en) * 1971-07-12 1973-07-17 Shell Oil Co Process for curing polyepoxides with polycarboxylic acid salts of an imidazole compound and compositions thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61501212A (en) * 1984-07-17 1986-06-19 ザ　ダウ　ケミカル　カンパニ− Manufacturing method of partially advanced epoxy resin
JPS63248824A (en) * 1987-04-03 1988-10-17 Shin Etsu Chem Co Ltd epoxy resin composition
US6084037A (en) * 1996-12-19 2000-07-04 Shin -Etsu Chemical Co., Ltd. Epoxy resin composition and semiconductor device
JP2018062570A (en) * 2016-10-13 2018-04-19 三菱瓦斯化学株式会社 Resin composition, resin sheet, printed wiring board, and semiconductor device

Also Published As

Publication number Publication date
JPS6154326B2 (en) 1986-11-21

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