JPS5710253A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5710253A
JPS5710253A JP8474480A JP8474480A JPS5710253A JP S5710253 A JPS5710253 A JP S5710253A JP 8474480 A JP8474480 A JP 8474480A JP 8474480 A JP8474480 A JP 8474480A JP S5710253 A JPS5710253 A JP S5710253A
Authority
JP
Japan
Prior art keywords
substrate
hole
curing
brazing
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8474480A
Other languages
Japanese (ja)
Inventor
Yoshiaki Matsumae
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8474480A priority Critical patent/JPS5710253A/en
Publication of JPS5710253A publication Critical patent/JPS5710253A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To seal, e.g. a high-output-power hybrid circuit in a container air-tightly by providing a ventilating hole in part of a substrate on which elements are mounted or of a frame, bonding the substrate and the frame by thermally curing bonding agent, curing the agent, and sealing the hole by brazing. CONSTITUTION:A plurality of elements 5 are mounted on a film-circuit substrate 1', on the back of which a heat radiating plate 2' is connected by a brazing material 8, and a lead terminal 4 is connected. A ventilating hole 11 is provided in said substrate 1' and said heat radiating plate 2'. The assembled substrate 1' is inserted in a resin frame 3 wherein a lead taking out groove 10 is provided, and the peripheral part is bonded by the thermally curing bonding agent 6. After the high-temperature curing process, the hole 11 is sealed by brazing a metal plug 9. The hole 11 can be provided in, e.g., a metal lid provided on the top surface. In this constitution, the air tightness at the bonded part is not broken at the time of curing, and the container sealing having excellent air tightness can be obtained.
JP8474480A 1980-06-23 1980-06-23 Semiconductor device Pending JPS5710253A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8474480A JPS5710253A (en) 1980-06-23 1980-06-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8474480A JPS5710253A (en) 1980-06-23 1980-06-23 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5710253A true JPS5710253A (en) 1982-01-19

Family

ID=13839193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8474480A Pending JPS5710253A (en) 1980-06-23 1980-06-23 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5710253A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2355146A1 (en) * 2010-01-27 2011-08-10 Thales Holdings UK Plc Integrated circuit package
CN105990275A (en) * 2014-09-30 2016-10-05 三星电机株式会社 Power module package and method of fabricating thereof
JP2018130769A (en) * 2017-02-13 2018-08-23 セイコーエプソン株式会社 Electronic device and method for manufacturing electronic device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2355146A1 (en) * 2010-01-27 2011-08-10 Thales Holdings UK Plc Integrated circuit package
CN105990275A (en) * 2014-09-30 2016-10-05 三星电机株式会社 Power module package and method of fabricating thereof
JP2018130769A (en) * 2017-02-13 2018-08-23 セイコーエプソン株式会社 Electronic device and method for manufacturing electronic device

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