JPS57109344A - Manufacture and its apparatus for semiconductor device - Google Patents

Manufacture and its apparatus for semiconductor device

Info

Publication number
JPS57109344A
JPS57109344A JP55183896A JP18389680A JPS57109344A JP S57109344 A JPS57109344 A JP S57109344A JP 55183896 A JP55183896 A JP 55183896A JP 18389680 A JP18389680 A JP 18389680A JP S57109344 A JPS57109344 A JP S57109344A
Authority
JP
Japan
Prior art keywords
pellet
paste
gas
jetted
tab
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55183896A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0330297B2 (2
Inventor
Susumu Okikawa
Hiroshi Mikino
Hiromichi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55183896A priority Critical patent/JPS57109344A/ja
Publication of JPS57109344A publication Critical patent/JPS57109344A/ja
Publication of JPH0330297B2 publication Critical patent/JPH0330297B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
JP55183896A 1980-12-26 1980-12-26 Manufacture and its apparatus for semiconductor device Granted JPS57109344A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55183896A JPS57109344A (en) 1980-12-26 1980-12-26 Manufacture and its apparatus for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55183896A JPS57109344A (en) 1980-12-26 1980-12-26 Manufacture and its apparatus for semiconductor device

Publications (2)

Publication Number Publication Date
JPS57109344A true JPS57109344A (en) 1982-07-07
JPH0330297B2 JPH0330297B2 (2) 1991-04-26

Family

ID=16143702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55183896A Granted JPS57109344A (en) 1980-12-26 1980-12-26 Manufacture and its apparatus for semiconductor device

Country Status (1)

Country Link
JP (1) JPS57109344A (2)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59188129A (ja) * 1983-04-08 1984-10-25 Oki Electric Ind Co Ltd 半導体装置の製造方法
JPS63127130U (2) * 1987-02-12 1988-08-19
JPS63316443A (ja) * 1987-06-19 1988-12-23 Hitachi Electronics Eng Co Ltd 銀ペ−ストキュア装置
JPS63316444A (ja) * 1987-06-19 1988-12-23 Hitachi Electronics Eng Co Ltd 銀ペ−ストキュア装置における加熱装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5023976A (2) * 1973-07-02 1975-03-14
JPS5386169A (en) * 1977-01-07 1978-07-29 Hitachi Ltd Exposure apparatus
JPS55121655A (en) * 1979-03-12 1980-09-18 Fujitsu Ltd Manufacture of semiconductor device
JPS57104231A (en) * 1980-12-19 1982-06-29 Fujitsu Ltd Attaching method of dice

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5023976A (2) * 1973-07-02 1975-03-14
JPS5386169A (en) * 1977-01-07 1978-07-29 Hitachi Ltd Exposure apparatus
JPS55121655A (en) * 1979-03-12 1980-09-18 Fujitsu Ltd Manufacture of semiconductor device
JPS57104231A (en) * 1980-12-19 1982-06-29 Fujitsu Ltd Attaching method of dice

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59188129A (ja) * 1983-04-08 1984-10-25 Oki Electric Ind Co Ltd 半導体装置の製造方法
JPS63127130U (2) * 1987-02-12 1988-08-19
JPS63316443A (ja) * 1987-06-19 1988-12-23 Hitachi Electronics Eng Co Ltd 銀ペ−ストキュア装置
JPS63316444A (ja) * 1987-06-19 1988-12-23 Hitachi Electronics Eng Co Ltd 銀ペ−ストキュア装置における加熱装置

Also Published As

Publication number Publication date
JPH0330297B2 (2) 1991-04-26

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