JPS57137492A - Electroplating for precipitate rhodium film - Google Patents

Electroplating for precipitate rhodium film

Info

Publication number
JPS57137492A
JPS57137492A JP57002915A JP291582A JPS57137492A JP S57137492 A JPS57137492 A JP S57137492A JP 57002915 A JP57002915 A JP 57002915A JP 291582 A JP291582 A JP 291582A JP S57137492 A JPS57137492 A JP S57137492A
Authority
JP
Japan
Prior art keywords
electroplating
rhodium film
precipitate rhodium
precipitate
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57002915A
Other languages
English (en)
Japanese (ja)
Other versions
JPH029115B2 (de
Inventor
Kuroitaa Erika
Kuun Buerunaa
Tsuirusuke Buorufugangu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Operations GmbH
Original Assignee
Degussa GmbH
Deutsche Gold und Silber Scheideanstalt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Degussa GmbH, Deutsche Gold und Silber Scheideanstalt filed Critical Degussa GmbH
Publication of JPS57137492A publication Critical patent/JPS57137492A/ja
Publication of JPH029115B2 publication Critical patent/JPH029115B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/50Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
JP57002915A 1981-01-15 1982-01-13 Electroplating for precipitate rhodium film Granted JPS57137492A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3100997A DE3100997C2 (de) 1981-01-15 1981-01-15 Bad zum galvanischen Abscheiden von Rhodiumüberzügen

Publications (2)

Publication Number Publication Date
JPS57137492A true JPS57137492A (en) 1982-08-25
JPH029115B2 JPH029115B2 (de) 1990-02-28

Family

ID=6122621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57002915A Granted JPS57137492A (en) 1981-01-15 1982-01-13 Electroplating for precipitate rhodium film

Country Status (5)

Country Link
EP (1) EP0056590B1 (de)
JP (1) JPS57137492A (de)
BR (1) BR8200158A (de)
DE (2) DE3100997C2 (de)
HK (1) HK51088A (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003518559A (ja) * 1999-12-23 2003-06-10 デグッサ ガルファノテヒニーク ゲーエムベーハー 高光沢白色ロジウムコーティングを電気メッキするための槽および電気メッキ槽のための白色化剤
JP2010525159A (ja) * 2007-04-20 2010-07-22 インターナショナル・ビジネス・マシーンズ・コーポレーション 電気メッキによるコンタクト用ロジウム構造の製造および電気メッキ用組成物
JP2022528163A (ja) * 2019-04-08 2022-06-08 ウミコレ・ガルファノテフニック・ゲーエムベーハー 無煙炭/黒色ロジウム/ルテニウム合金層の析出のための電解質

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5224131A (en) * 1975-08-14 1977-02-23 Dowa Mining Co Luster* thick rhodium plating method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3528895A (en) * 1967-07-10 1970-09-15 Sel Rex Corp Plating low stress bright rhodium
US3671408A (en) * 1971-05-25 1972-06-20 Sel Rex Corp Rhodium-platinum plating bath and process
DD109409A1 (de) * 1974-01-31 1974-11-05
DE2506467C2 (de) * 1975-02-07 1986-07-17 Schering AG, 1000 Berlin und 4709 Bergkamen Bad und Verfahren zur galvanischen Abscheidung von Palladium-Nickel-Legierungen
EP0048929B1 (de) * 1980-09-25 1987-12-09 Nippon Mining Company Limited Mit Rhodium einer schwarzen oder blauen Farbe bekleideter Gegenstand, Verfahren zu dessen Herstellung und Bad dafür

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5224131A (en) * 1975-08-14 1977-02-23 Dowa Mining Co Luster* thick rhodium plating method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003518559A (ja) * 1999-12-23 2003-06-10 デグッサ ガルファノテヒニーク ゲーエムベーハー 高光沢白色ロジウムコーティングを電気メッキするための槽および電気メッキ槽のための白色化剤
JP2010525159A (ja) * 2007-04-20 2010-07-22 インターナショナル・ビジネス・マシーンズ・コーポレーション 電気メッキによるコンタクト用ロジウム構造の製造および電気メッキ用組成物
JP2022528163A (ja) * 2019-04-08 2022-06-08 ウミコレ・ガルファノテフニック・ゲーエムベーハー 無煙炭/黒色ロジウム/ルテニウム合金層の析出のための電解質

Also Published As

Publication number Publication date
DE3100997C2 (de) 1986-08-14
HK51088A (en) 1988-07-15
DE3263183D1 (en) 1985-05-30
JPH029115B2 (de) 1990-02-28
EP0056590B1 (de) 1985-04-24
EP0056590A1 (de) 1982-07-28
DE3100997A1 (de) 1982-08-05
BR8200158A (pt) 1982-11-03

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