JPS57149332A - Photocurable prepreg - Google Patents

Photocurable prepreg

Info

Publication number
JPS57149332A
JPS57149332A JP3609381A JP3609381A JPS57149332A JP S57149332 A JPS57149332 A JP S57149332A JP 3609381 A JP3609381 A JP 3609381A JP 3609381 A JP3609381 A JP 3609381A JP S57149332 A JPS57149332 A JP S57149332A
Authority
JP
Japan
Prior art keywords
substrate
heat
resin composition
photocurable resin
prepard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3609381A
Other languages
Japanese (ja)
Other versions
JPS625451B2 (en
Inventor
Hiroyuki Nakajima
Shohei Eto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP3609381A priority Critical patent/JPS57149332A/en
Publication of JPS57149332A publication Critical patent/JPS57149332A/en
Publication of JPS625451B2 publication Critical patent/JPS625451B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
  • Insulating Bodies (AREA)

Abstract

PURPOSE: The titled prepreg which, when irradiated with light, is readily cured and bound, prepared by infiltrating a specified photocurable resin composition into a substrate prepard by heat-bonding an aromatic polyamide paper to a laminated mica containing a polymeric fibrid and drying the infiltrated substrate to a tack-free state.
CONSTITUTION: A photocurable resin composition is obtained by reacting an unsaturated monobasic acid with a quinazolone-modified epoxy resin obtained by reacting 1 eq. quinazolone ring-containing dicarboxylic acid compound of the formula, wherein R is an aliphatic or aromatic bivalent group, with 1.2W5eq. epoxy resin. Then, the photocurable resin composition is coated on or infiltrated into a substrate prepard by heat-bonding 100pts.wt. laminated mica paper containing 1W10% polymeric fibrid as a heat-binder to 20W120pts.wt. aromatic polyamide paper (e.g., isophthalic acid/m-phenylenediamine copolymer) and then dried at 50W200°C for 1W60min to a tack-free state.
COPYRIGHT: (C)1982,JPO&Japio
JP3609381A 1981-03-11 1981-03-11 Photocurable prepreg Granted JPS57149332A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3609381A JPS57149332A (en) 1981-03-11 1981-03-11 Photocurable prepreg

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3609381A JPS57149332A (en) 1981-03-11 1981-03-11 Photocurable prepreg

Publications (2)

Publication Number Publication Date
JPS57149332A true JPS57149332A (en) 1982-09-14
JPS625451B2 JPS625451B2 (en) 1987-02-05

Family

ID=12460133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3609381A Granted JPS57149332A (en) 1981-03-11 1981-03-11 Photocurable prepreg

Country Status (1)

Country Link
JP (1) JPS57149332A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025537082A (en) * 2022-10-11 2025-11-14 イリノイ トゥール ワークス インコーポレイティド High-temperature resistant insulating film

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025537082A (en) * 2022-10-11 2025-11-14 イリノイ トゥール ワークス インコーポレイティド High-temperature resistant insulating film

Also Published As

Publication number Publication date
JPS625451B2 (en) 1987-02-05

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