JPS5716199A - Plating apparatus - Google Patents

Plating apparatus

Info

Publication number
JPS5716199A
JPS5716199A JP9056280A JP9056280A JPS5716199A JP S5716199 A JPS5716199 A JP S5716199A JP 9056280 A JP9056280 A JP 9056280A JP 9056280 A JP9056280 A JP 9056280A JP S5716199 A JPS5716199 A JP S5716199A
Authority
JP
Japan
Prior art keywords
wafer
anode
plating
hermetically sealed
sealed space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9056280A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6241320B2 (2
Inventor
Hiroaki Okuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9056280A priority Critical patent/JPS5716199A/ja
Publication of JPS5716199A publication Critical patent/JPS5716199A/ja
Publication of JPS6241320B2 publication Critical patent/JPS6241320B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP9056280A 1980-07-04 1980-07-04 Plating apparatus Granted JPS5716199A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9056280A JPS5716199A (en) 1980-07-04 1980-07-04 Plating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9056280A JPS5716199A (en) 1980-07-04 1980-07-04 Plating apparatus

Publications (2)

Publication Number Publication Date
JPS5716199A true JPS5716199A (en) 1982-01-27
JPS6241320B2 JPS6241320B2 (2) 1987-09-02

Family

ID=14001857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9056280A Granted JPS5716199A (en) 1980-07-04 1980-07-04 Plating apparatus

Country Status (1)

Country Link
JP (1) JPS5716199A (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61205129A (ja) * 1985-03-08 1986-09-11 日本鋼管株式会社 塗装後光沢を有する電気鍍金鋼板
JP2007119926A (ja) * 2007-02-13 2007-05-17 Ebara Corp 基板メッキ装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61205129A (ja) * 1985-03-08 1986-09-11 日本鋼管株式会社 塗装後光沢を有する電気鍍金鋼板
JP2007119926A (ja) * 2007-02-13 2007-05-17 Ebara Corp 基板メッキ装置

Also Published As

Publication number Publication date
JPS6241320B2 (2) 1987-09-02

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