JPS57165272A - Connecting method for wire bonding - Google Patents

Connecting method for wire bonding

Info

Publication number
JPS57165272A
JPS57165272A JP56050220A JP5022081A JPS57165272A JP S57165272 A JPS57165272 A JP S57165272A JP 56050220 A JP56050220 A JP 56050220A JP 5022081 A JP5022081 A JP 5022081A JP S57165272 A JPS57165272 A JP S57165272A
Authority
JP
Japan
Prior art keywords
terminals
connecting wire
wire
spaced
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56050220A
Other languages
Japanese (ja)
Inventor
Keiichi Takizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56050220A priority Critical patent/JPS57165272A/en
Publication of JPS57165272A publication Critical patent/JPS57165272A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electronic Switches (AREA)
  • Facsimile Heads (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To enable to perform a bonding in high density, by a method wherein a connectibg wire for coupling together connecting terminals spaced at a long distance is positioned in a higher level than that of a connecting wire for connecting together teminals spaced at a short distance. CONSTITUTION:A conductor 16 connected to a heating resistor is formed on an insulating substrate 15 whereon a plural number of heating resistors is installed, and connecting terminals 162 are attached in a zigzag pattern to the end of the conductor 16. A diode array 12, whererin 8 diodes are housed in a chip, is placed on the substrate 15, and terminals, which work as a bonding butt corresponding to each diode, are attached in a zigzag pattern on the array 12. In case the connecting terminals 162 are connected to their respective terminals 122, the terminals spaced at a short distance are bonded through a connecting wire 171, the terminals at a long distance through a connecting wire 172, and the connecting wire 172 is located in a higher level by a difference of, for example, 0.05-0.1mm., in height than that of the connecting wire 171.
JP56050220A 1981-04-03 1981-04-03 Connecting method for wire bonding Pending JPS57165272A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56050220A JPS57165272A (en) 1981-04-03 1981-04-03 Connecting method for wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56050220A JPS57165272A (en) 1981-04-03 1981-04-03 Connecting method for wire bonding

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP27795786A Division JPS62142660A (en) 1986-11-21 1986-11-21 Wire bonding connection for thermal recording head

Publications (1)

Publication Number Publication Date
JPS57165272A true JPS57165272A (en) 1982-10-12

Family

ID=12852961

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56050220A Pending JPS57165272A (en) 1981-04-03 1981-04-03 Connecting method for wire bonding

Country Status (1)

Country Link
JP (1) JPS57165272A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60167286A (en) * 1984-02-10 1985-08-30 キヤノン株式会社 Structure of electric connector in electronic device
JPS61184869A (en) * 1985-02-12 1986-08-18 Mitsubishi Electric Corp Image sensor
JPH0334337A (en) * 1990-06-06 1991-02-14 Seiko Epson Corp Semiconductor integrated circuit
JP2023528696A (en) * 2020-03-27 2023-07-06 京東方科技集團股▲ふん▼有限公司 Display panel and display device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5299769A (en) * 1976-02-18 1977-08-22 Toshiba Corp Pellet for semiconductor device
JPS5524479A (en) * 1978-08-09 1980-02-21 Nec Corp Semiconductor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5299769A (en) * 1976-02-18 1977-08-22 Toshiba Corp Pellet for semiconductor device
JPS5524479A (en) * 1978-08-09 1980-02-21 Nec Corp Semiconductor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60167286A (en) * 1984-02-10 1985-08-30 キヤノン株式会社 Structure of electric connector in electronic device
JPS61184869A (en) * 1985-02-12 1986-08-18 Mitsubishi Electric Corp Image sensor
JPH0334337A (en) * 1990-06-06 1991-02-14 Seiko Epson Corp Semiconductor integrated circuit
JP2023528696A (en) * 2020-03-27 2023-07-06 京東方科技集團股▲ふん▼有限公司 Display panel and display device

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