JPS57192029A - Mask set and positioning method for mask - Google Patents

Mask set and positioning method for mask

Info

Publication number
JPS57192029A
JPS57192029A JP56077212A JP7721281A JPS57192029A JP S57192029 A JPS57192029 A JP S57192029A JP 56077212 A JP56077212 A JP 56077212A JP 7721281 A JP7721281 A JP 7721281A JP S57192029 A JPS57192029 A JP S57192029A
Authority
JP
Japan
Prior art keywords
mask
pointed ends
masks
displacement
detected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56077212A
Other languages
Japanese (ja)
Inventor
Toshio Sugawa
Takeshi Konuma
Hideki Yakida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56077212A priority Critical patent/JPS57192029A/en
Publication of JPS57192029A publication Critical patent/JPS57192029A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/42—Alignment or registration features, e.g. alignment marks on the mask substrates

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

PURPOSE:To position the masks accurately in a short time by positioning the masks by the relative positions of mutual points formed by the pointed ends of the masks. CONSTITUTION:The first mask A takes the form of a star crossed alignment key with four pointed ends. The second mask B takes the form of an alignment key in which four isosceles triangles are each arranged so that a central axis has the angle of 90 deg. while the apices are mutually opposed. Dispacement in the left and right direction is detected at 5, 7 to the pointed ends, 1, 3 and one in the vertical direction at 8, 6 to 4, 2. Rotary displacement is detected through the displacement of the four pointed ends in the same direction of revolution. accordingly, the displacement of alignment of the mask A and the mask B is easily detected.
JP56077212A 1981-05-20 1981-05-20 Mask set and positioning method for mask Pending JPS57192029A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56077212A JPS57192029A (en) 1981-05-20 1981-05-20 Mask set and positioning method for mask

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56077212A JPS57192029A (en) 1981-05-20 1981-05-20 Mask set and positioning method for mask

Publications (1)

Publication Number Publication Date
JPS57192029A true JPS57192029A (en) 1982-11-26

Family

ID=13627517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56077212A Pending JPS57192029A (en) 1981-05-20 1981-05-20 Mask set and positioning method for mask

Country Status (1)

Country Link
JP (1) JPS57192029A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6093511A (en) * 1994-06-30 2000-07-25 Fujitsu Limited Method of manufacturing semiconductor device
JP2017504014A (en) * 2013-12-21 2017-02-02 ケーエルエー−テンカー コーポレイション Position sensitive substrate device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5394878A (en) * 1977-01-31 1978-08-19 Matsushita Electric Ind Co Ltd Mask matching key
JPS5454579A (en) * 1977-10-11 1979-04-28 Toshiba Corp Exposure method
JPS5651839A (en) * 1979-10-05 1981-05-09 Nec Corp Semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5394878A (en) * 1977-01-31 1978-08-19 Matsushita Electric Ind Co Ltd Mask matching key
JPS5454579A (en) * 1977-10-11 1979-04-28 Toshiba Corp Exposure method
JPS5651839A (en) * 1979-10-05 1981-05-09 Nec Corp Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6093511A (en) * 1994-06-30 2000-07-25 Fujitsu Limited Method of manufacturing semiconductor device
JP2017504014A (en) * 2013-12-21 2017-02-02 ケーエルエー−テンカー コーポレイション Position sensitive substrate device

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