JPS57192078A - Manufacture of mos semiconductor device - Google Patents
Manufacture of mos semiconductor deviceInfo
- Publication number
- JPS57192078A JPS57192078A JP56076556A JP7655681A JPS57192078A JP S57192078 A JPS57192078 A JP S57192078A JP 56076556 A JP56076556 A JP 56076556A JP 7655681 A JP7655681 A JP 7655681A JP S57192078 A JPS57192078 A JP S57192078A
- Authority
- JP
- Japan
- Prior art keywords
- type
- phosphorus
- oxide film
- photo etching
- gate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
Abstract
PURPOSE:To reduce output capacity and to enhance high frequency capaciteristic of an MOS semiconductor device by a method wherein after openings for source and drain are formed, impurities of phosphorus are made to dope in a P type substrate by ion implantation, an opening for gate is formed immediately, and activation of phosphorus and formation of a gate oxide film are performed. CONSTITUTION:An N type selective diffusion layer 11 and protective diodes for a P<+> type selective diffusion layer 12 are formed at a part of the main face of a P type Si substrate 10, impurities are doped from the openings 10a, 10b, photo etching of an oxide film at the gate part 10c is performed immediately, activation of impurity ions of phosphorus is performed by thermal oxidation to form N<+> type layers 14, and at the same time, the thin gate oxide film 15 is formed. Then an Mo film 16 is formed, photo etching is performed, N type layers (source and drain) 17 are formed by phosphorus ions implantation, an SiO2 film 18 is formed by the CVD method, and after photo etching is performed, Al electrodes 19 are formed by evaporation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56076556A JPS57192078A (en) | 1981-05-22 | 1981-05-22 | Manufacture of mos semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56076556A JPS57192078A (en) | 1981-05-22 | 1981-05-22 | Manufacture of mos semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57192078A true JPS57192078A (en) | 1982-11-26 |
Family
ID=13608523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56076556A Pending JPS57192078A (en) | 1981-05-22 | 1981-05-22 | Manufacture of mos semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57192078A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5028556A (en) * | 1990-02-16 | 1991-07-02 | Hughes Aircraft Company | Process for fabricating radiation hard high voltage devices |
| JPH0422136A (en) * | 1990-05-17 | 1992-01-27 | Fujitsu Ltd | Manufacture of semiconductor device |
-
1981
- 1981-05-22 JP JP56076556A patent/JPS57192078A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5028556A (en) * | 1990-02-16 | 1991-07-02 | Hughes Aircraft Company | Process for fabricating radiation hard high voltage devices |
| JPH0422136A (en) * | 1990-05-17 | 1992-01-27 | Fujitsu Ltd | Manufacture of semiconductor device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4463492A (en) | Method of forming a semiconductor device on insulating substrate by selective amorphosization followed by simultaneous activation and reconversion to single crystal state | |
| JPS6115594B2 (en) | ||
| US3886003A (en) | Method of making an integrated circuit | |
| JPS5736842A (en) | Semiconductor integrated circuit device | |
| JPS57192078A (en) | Manufacture of mos semiconductor device | |
| JPS6360549B2 (en) | ||
| JPS5649554A (en) | Manufacture of semiconductor memory | |
| JPS57107067A (en) | Manufacture of semiconductor device | |
| JPS56107552A (en) | Manufacture of semiconductor device | |
| JPS61154172A (en) | Manufacture of semiconductor device | |
| JPS63181378A (en) | Manufacture of semiconductor device | |
| JPS57194583A (en) | Mos semiconductor device and manufacture thereof | |
| JPS56153769A (en) | Manufacture of semiconductor device | |
| JPS5649553A (en) | Manufacture of semiconductor memory | |
| JPS57192073A (en) | Semiconductor device | |
| JPS62130562A (en) | Manufacture of field effect transistor | |
| JPH0479336A (en) | Production of semiconductor device | |
| JPS5651871A (en) | Manufacture of complementary type mos semiconductor device | |
| KR940010540B1 (en) | Isolating area forming method having gettering function and their structure | |
| JPS5721855A (en) | Manufacture of complementary mos semiconductor device | |
| JPS6157714B2 (en) | ||
| JPS57192077A (en) | Semiconductor device | |
| JPH03204968A (en) | Semiconductor device and manufacture thereof | |
| JPS57104258A (en) | Metal oxide semiconductor | |
| JPS62131538A (en) | Manufacture of semiconductor device |