JPS57198724A - Epoxy resin molding composition - Google Patents
Epoxy resin molding compositionInfo
- Publication number
- JPS57198724A JPS57198724A JP8291781A JP8291781A JPS57198724A JP S57198724 A JPS57198724 A JP S57198724A JP 8291781 A JP8291781 A JP 8291781A JP 8291781 A JP8291781 A JP 8291781A JP S57198724 A JPS57198724 A JP S57198724A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- molding composition
- inorganic filler
- resin molding
- mechanical strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 4
- 238000000465 moulding Methods 0.000 title abstract 4
- 229920000647 polyepoxide Polymers 0.000 title abstract 4
- 239000000203 mixture Substances 0.000 title abstract 3
- 239000011256 inorganic filler Substances 0.000 abstract 3
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 3
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 239000002245 particle Substances 0.000 abstract 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 abstract 1
- 239000007822 coupling agent Substances 0.000 abstract 1
- 239000011152 fibreglass Substances 0.000 abstract 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: An epoxy resin molding composition that is produced by adding a porous inorganic filler of particle sizes in a specific range and a curing agent to an epoxy resin, thus giving moldings of high mechanical strength by no use of fiber glass.
CONSTITUTION: The objective molding composition comprises 20W30pts.wt. of an epoxy resin such as bisphenol-A epoxy resin, 3W6pts. of a curing agent such as dicyandiamde, 55W65pts. of an inorganic filler containing particles of 10W5μ sizes by 30W40wt%, of 5W2μ by 45W55wt% such as kieselguhr, and when necessary, 0.3W0.7wt%, based on the inorganic filler, of an aminosilane coupling agent such as γ-aminopropyltriethoxysilane.
EFFECT: The formed products have high mechanical strength.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8291781A JPS57198724A (en) | 1981-05-30 | 1981-05-30 | Epoxy resin molding composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8291781A JPS57198724A (en) | 1981-05-30 | 1981-05-30 | Epoxy resin molding composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57198724A true JPS57198724A (en) | 1982-12-06 |
Family
ID=13787594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8291781A Pending JPS57198724A (en) | 1981-05-30 | 1981-05-30 | Epoxy resin molding composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57198724A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100504289B1 (en) * | 2001-12-28 | 2005-07-27 | 제일모직주식회사 | Epoxy Molding Compound Composition With Excellent Crack Resistance At High Temperature |
-
1981
- 1981-05-30 JP JP8291781A patent/JPS57198724A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100504289B1 (en) * | 2001-12-28 | 2005-07-27 | 제일모직주식회사 | Epoxy Molding Compound Composition With Excellent Crack Resistance At High Temperature |
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