JPS5720432A - Formation of ohmic electrode - Google Patents
Formation of ohmic electrodeInfo
- Publication number
- JPS5720432A JPS5720432A JP9501180A JP9501180A JPS5720432A JP S5720432 A JPS5720432 A JP S5720432A JP 9501180 A JP9501180 A JP 9501180A JP 9501180 A JP9501180 A JP 9501180A JP S5720432 A JPS5720432 A JP S5720432A
- Authority
- JP
- Japan
- Prior art keywords
- film
- electrodes
- alloy
- electrode
- ohmic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
Landscapes
- Electrodes Of Semiconductors (AREA)
Abstract
PURPOSE:To increase the reliability of an ohmic electrode for an FET or the like by forming a high melting point metal layer of Pt, Ni or the like at a predetermined thickness ratio on an Au-Ge alloy film covered on a GaAs substrate, and alloying it with plasma Si3N4 film by covering, thereby smoothing the electrode. CONSTITUTION:An Au-Ge alloy film and, for example, an Ni film of the thickness of 1/5-1/20 of the alloy film are formed as source and drain electrodes 3, 4 on a semi-insulating substrate 1 epitaxially grown with N type operation layer 2. After an Si3N4 film 5 is covered at low temperature (lower than 350 deg.C) by a plasma CVD method, it is alloyed in an ohmic contact. Then, the film 5 is opened, a pad electrode 6 made of Cr, Au is formed, and source and drain electrodes are thus completed. Since the ball-up of the alloy can be prevented in this manner, the surfaces of the electrodes can be smoothed, and the ohmic electrodes which are not deteriorated at the contacting resistance at high temperature can be provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9501180A JPS5720432A (en) | 1980-07-14 | 1980-07-14 | Formation of ohmic electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9501180A JPS5720432A (en) | 1980-07-14 | 1980-07-14 | Formation of ohmic electrode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5720432A true JPS5720432A (en) | 1982-02-02 |
Family
ID=14126011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9501180A Pending JPS5720432A (en) | 1980-07-14 | 1980-07-14 | Formation of ohmic electrode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5720432A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02116750U (en) * | 1990-03-15 | 1990-09-19 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50116181A (en) * | 1974-02-26 | 1975-09-11 | ||
| JPS541429A (en) * | 1977-06-06 | 1979-01-08 | Hitachi Ltd | Valve device for fluid control |
| JPS558036A (en) * | 1978-06-30 | 1980-01-21 | Nec Corp | Electrode formation |
-
1980
- 1980-07-14 JP JP9501180A patent/JPS5720432A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50116181A (en) * | 1974-02-26 | 1975-09-11 | ||
| JPS541429A (en) * | 1977-06-06 | 1979-01-08 | Hitachi Ltd | Valve device for fluid control |
| JPS558036A (en) * | 1978-06-30 | 1980-01-21 | Nec Corp | Electrode formation |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02116750U (en) * | 1990-03-15 | 1990-09-19 |
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