JPS5720439A - Bonding method for semiconductor pellet - Google Patents

Bonding method for semiconductor pellet

Info

Publication number
JPS5720439A
JPS5720439A JP9534080A JP9534080A JPS5720439A JP S5720439 A JPS5720439 A JP S5720439A JP 9534080 A JP9534080 A JP 9534080A JP 9534080 A JP9534080 A JP 9534080A JP S5720439 A JPS5720439 A JP S5720439A
Authority
JP
Japan
Prior art keywords
cam
pellet
collet
solder
collided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9534080A
Other languages
Japanese (ja)
Inventor
Masaaki Shimotomai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9534080A priority Critical patent/JPS5720439A/en
Publication of JPS5720439A publication Critical patent/JPS5720439A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE:To improve the adherence of a semiconductor pellet without providing complicated mechanism by forming at least one projection on the cam of a cam mechanism for elevatonally moving a collet, and repeatedly colliding with the solder on a lead conductor and the pellet. CONSTITUTION:A collet 4 attracting a pellet at the end is downwardly pressed by gas introduced into a holding box 8, and is supported by a hook mechanism 15 via a pin 17. When the rotation of the cam 9 is transmitted through a cam lever 10 and a connecting leverl 13, the mechanism 15 is rotated around the fulcrum 16, the collet 4 is moved elevationally, and the pellet is collided with molten solder on an external lead conductor. A cam 9a of the shape provided with a projection 91 is used for the cam, the collet 4 is elevationally moved several times during one revolution of the cam 9a, and is thus collided with the molten solder repeatedly. Thus, the soldability of the pellet and the solder can be improved, and the adherence can be improved.
JP9534080A 1980-07-10 1980-07-10 Bonding method for semiconductor pellet Pending JPS5720439A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9534080A JPS5720439A (en) 1980-07-10 1980-07-10 Bonding method for semiconductor pellet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9534080A JPS5720439A (en) 1980-07-10 1980-07-10 Bonding method for semiconductor pellet

Publications (1)

Publication Number Publication Date
JPS5720439A true JPS5720439A (en) 1982-02-02

Family

ID=14134961

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9534080A Pending JPS5720439A (en) 1980-07-10 1980-07-10 Bonding method for semiconductor pellet

Country Status (1)

Country Link
JP (1) JPS5720439A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01124697A (en) * 1987-09-01 1989-05-17 A Ahlstroem Oy Method and apparatus for grading fiber suspension

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01124697A (en) * 1987-09-01 1989-05-17 A Ahlstroem Oy Method and apparatus for grading fiber suspension

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