JPS57210986A - Partial plating method - Google Patents
Partial plating methodInfo
- Publication number
- JPS57210986A JPS57210986A JP9475581A JP9475581A JPS57210986A JP S57210986 A JPS57210986 A JP S57210986A JP 9475581 A JP9475581 A JP 9475581A JP 9475581 A JP9475581 A JP 9475581A JP S57210986 A JPS57210986 A JP S57210986A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- nozzle
- plated
- soln
- thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title abstract 11
- 238000000034 method Methods 0.000 title 1
- 238000002347 injection Methods 0.000 abstract 3
- 239000007924 injection Substances 0.000 abstract 3
- 229910000510 noble metal Inorganic materials 0.000 abstract 3
- 239000013013 elastic material Substances 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 239000002699 waste material Substances 0.000 abstract 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To form a thick plating layer locally only on the required part in the stage of electroplating of noble metals or the like by forming a nozzle for injecting a plating soln. into the shape similar to that of the part to be thickly plated and controling the flow of the plating soln. and electric lines of force.
CONSTITUTION: An elastic material sheet 2 provided with a through-hole 5 for partial plating and a receiving frame 3 are fixed to an object 1 to be plated, and an insulation characteristic nozzle 14 and an insoluble anode 15 are disposed. With the object 1 in the hole 5 as the cathode, a plating soln. is injected to plate noble metals such as gold, silver or the like on said part. Here, the nozzle 14 is provided with one or plural holes for injection of the plating soln. and is made into the shape similar to that of the part to be thickly plated. The shape of the thick-walled part of the plating layer is defined by setting the anode 15 in the position of a shaded part 22, that is, in the position where the thinly plated part is kept free from direct injection of the plating soln. from the nozzle injection ports and shielding the electric lines of force other than the thickly plated part with the nozzle. The inter-electrode distance is set within 20mm, whereby the thick-walled plating layer is formed only on the required part and the waste of plating by noble metals is eliminated.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9475581A JPS57210986A (en) | 1981-06-18 | 1981-06-18 | Partial plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9475581A JPS57210986A (en) | 1981-06-18 | 1981-06-18 | Partial plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57210986A true JPS57210986A (en) | 1982-12-24 |
Family
ID=14118918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9475581A Pending JPS57210986A (en) | 1981-06-18 | 1981-06-18 | Partial plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57210986A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5995165U (en) * | 1982-12-15 | 1984-06-28 | 凸版印刷株式会社 | Mask board for partial plating |
| JPS61110790A (en) * | 1984-11-05 | 1986-05-29 | Electroplating Eng Of Japan Co | Jet plating method of ic lead frame |
-
1981
- 1981-06-18 JP JP9475581A patent/JPS57210986A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5995165U (en) * | 1982-12-15 | 1984-06-28 | 凸版印刷株式会社 | Mask board for partial plating |
| JPS61110790A (en) * | 1984-11-05 | 1986-05-29 | Electroplating Eng Of Japan Co | Jet plating method of ic lead frame |
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