JPS6431992A - Plating device - Google Patents
Plating deviceInfo
- Publication number
- JPS6431992A JPS6431992A JP18968087A JP18968087A JPS6431992A JP S6431992 A JPS6431992 A JP S6431992A JP 18968087 A JP18968087 A JP 18968087A JP 18968087 A JP18968087 A JP 18968087A JP S6431992 A JPS6431992 A JP S6431992A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- metallic wire
- wire
- soln
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title abstract 14
- 239000002184 metal Substances 0.000 abstract 3
- 229910021645 metal ion Inorganic materials 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE:To plate a metallic wire at a high rate by traveling the metallic wire as a cathode through the inside of a cylindrical anode contg. a granular plating metal in a cylindrical plating bath of a specified structure, circulating a plating soln. in the cylindrical anode to form a forced jet, and carrying out electroplatinnng at a high current density. CONSTITUTION:The metallic wire (a) to be plated is traveled in the plating bath 4 as a cathode, the plating soln. 2 is circulated by a circulating pump 5, a plating current at high density is applied between the wire (a) and a middle cylinder 42 as an anode to form a plating layer on the surface of the metallic wire (a) at a high rate. The metallic wire (a) is surrounded by a wire-mesh inner cylinder 41 in the plating bath 4, a granular metal block 43 as the ion supply source of the plating metal is placed between the inner cylinder 41 and the middle cylinder 42 on the outside, and the middle cylinder 42 is inserted into an outer cylinder 44 made of an insulating resin. Since the plating soln. 2 in a tank 1 is jetted in the plating bath by a pump 3, the consumed metal ion in the plating soln. on the outer periphery of the metallic wire (a) is replenished, and a plating layer can be formed on the metallic wire (a) at a high rate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18968087A JPS6431992A (en) | 1987-07-28 | 1987-07-28 | Plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18968087A JPS6431992A (en) | 1987-07-28 | 1987-07-28 | Plating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6431992A true JPS6431992A (en) | 1989-02-02 |
Family
ID=16245382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18968087A Pending JPS6431992A (en) | 1987-07-28 | 1987-07-28 | Plating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6431992A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03150393A (en) * | 1989-11-06 | 1991-06-26 | Mitsubishi Electric Corp | Device for continuously plating wire |
| JP2023173163A (en) * | 2022-05-25 | 2023-12-07 | トクセン工業株式会社 | Manufacturing method and electroplating device for plated wire |
-
1987
- 1987-07-28 JP JP18968087A patent/JPS6431992A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03150393A (en) * | 1989-11-06 | 1991-06-26 | Mitsubishi Electric Corp | Device for continuously plating wire |
| JP2023173163A (en) * | 2022-05-25 | 2023-12-07 | トクセン工業株式会社 | Manufacturing method and electroplating device for plated wire |
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