JPS5723060A - Zinc oxide target for high frequency sputtering - Google Patents

Zinc oxide target for high frequency sputtering

Info

Publication number
JPS5723060A
JPS5723060A JP9838380A JP9838380A JPS5723060A JP S5723060 A JPS5723060 A JP S5723060A JP 9838380 A JP9838380 A JP 9838380A JP 9838380 A JP9838380 A JP 9838380A JP S5723060 A JPS5723060 A JP S5723060A
Authority
JP
Japan
Prior art keywords
target
zinc oxide
lid
cylindrical
connecting joint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9838380A
Other languages
Japanese (ja)
Inventor
Shinji Shimazaki
Takayuki Kuroda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP9838380A priority Critical patent/JPS5723060A/en
Publication of JPS5723060A publication Critical patent/JPS5723060A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To form a target with excellent treating capacity by a method wherein a cylindrical zinc oxide target having a connecting joint part at an upper and a lower ends thereof is stacked in pulural steps and, further, a lid like zinc oxide target is connected to a lower most step thereof. CONSTITUTION:A zinc oxide powder is subjected to preliminary baking in air and, after wet grinding, dried and dehydrated. The resultant powder is mixed with a sticking agent and the obtained mixture is preliminarily molded into a desired column like form and, subsequently, final molding is carried out by hydrostatic press. The formed column like molded object is dried and subjected to polishing and shaving processing to form a cylindrical shape and a lid like shape and, thereafter, baking is carried out in the open air to obtain zinc oxide targets 5, 7. The cylindrical target 5 has connecting joint parts 6, 6' at an upper and a lower ends thereof and the lid like target 7 has a connecting step part 8 at an opening end thereof. The cylindrical target 5 is engaged at the connecting joint parts and stacked in plural steps and the lid like target 7 is connected to a lower most step thereof to form one target at a whole. Thereby, treating capacity of an article 13 to be sputtered can be enhanced.
JP9838380A 1980-07-17 1980-07-17 Zinc oxide target for high frequency sputtering Pending JPS5723060A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9838380A JPS5723060A (en) 1980-07-17 1980-07-17 Zinc oxide target for high frequency sputtering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9838380A JPS5723060A (en) 1980-07-17 1980-07-17 Zinc oxide target for high frequency sputtering

Publications (1)

Publication Number Publication Date
JPS5723060A true JPS5723060A (en) 1982-02-06

Family

ID=14218339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9838380A Pending JPS5723060A (en) 1980-07-17 1980-07-17 Zinc oxide target for high frequency sputtering

Country Status (1)

Country Link
JP (1) JPS5723060A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60126619U (en) * 1984-02-06 1985-08-26 株式会社ノダ architectural floorboards
JPS61102737U (en) * 1984-12-13 1986-06-30
JPH0558744U (en) * 1992-01-22 1993-08-03 株式会社▲桟▼製材所 Flooring material
JP2012046807A (en) * 2010-08-30 2012-03-08 Solar Applied Materials Technology Corp Hollow target assembly
CN107523794A (en) * 2017-09-07 2017-12-29 于盟盟 A kind of target for being used to sputter transparent conductive film

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60126619U (en) * 1984-02-06 1985-08-26 株式会社ノダ architectural floorboards
JPS61102737U (en) * 1984-12-13 1986-06-30
JPH0558744U (en) * 1992-01-22 1993-08-03 株式会社▲桟▼製材所 Flooring material
JP2012046807A (en) * 2010-08-30 2012-03-08 Solar Applied Materials Technology Corp Hollow target assembly
CN107523794A (en) * 2017-09-07 2017-12-29 于盟盟 A kind of target for being used to sputter transparent conductive film

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