JPS5732360A - Method and device for regeneration of chemical copper plating solution - Google Patents
Method and device for regeneration of chemical copper plating solutionInfo
- Publication number
- JPS5732360A JPS5732360A JP10773980A JP10773980A JPS5732360A JP S5732360 A JPS5732360 A JP S5732360A JP 10773980 A JP10773980 A JP 10773980A JP 10773980 A JP10773980 A JP 10773980A JP S5732360 A JPS5732360 A JP S5732360A
- Authority
- JP
- Japan
- Prior art keywords
- ions
- plating
- vessel
- soln
- harmful
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title abstract 9
- 239000010949 copper Substances 0.000 title abstract 6
- 239000000126 substance Substances 0.000 title abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 2
- 229910052802 copper Inorganic materials 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- 230000008929 regeneration Effects 0.000 title 1
- 238000011069 regeneration method Methods 0.000 title 1
- 150000002500 ions Chemical class 0.000 abstract 10
- 238000000909 electrodialysis Methods 0.000 abstract 3
- 238000005342 ion exchange Methods 0.000 abstract 2
- 229910001413 alkali metal ion Inorganic materials 0.000 abstract 1
- 239000003957 anion exchange resin Substances 0.000 abstract 1
- 239000002738 chelating agent Substances 0.000 abstract 1
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- -1 hydroxyl ions Chemical class 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 238000011282 treatment Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D61/00—Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
- B01D61/42—Electrodialysis; Electro-osmosis ; Electro-ultrafiltration; Membrane capacitive deionization
- B01D61/44—Ion-selective electrodialysis
Landscapes
- Engineering & Computer Science (AREA)
- Water Supply & Treatment (AREA)
- Health & Medical Sciences (AREA)
- Urology & Nephrology (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemically Coating (AREA)
Abstract
PURPOSE: To selectively remove harmful ions without causing change of properties of a chemical copper plating soln. wherein harmful ions are accumulated through plating operation, and regenerate the plating soln. by subjecting said plating soln. to combined treatments of ion exchanging and electrodialysis.
CONSTITUTION: Cu ions, reducing agents and hydroxyl ions are replenished respectively from replenishing vessels 2, 3, 4, into a chemical Cu plating vessel 1, whereby chemical Cu plating is accomplished. To remove the harmful Na, So4, HCOO, CO3 ions, etc. having been accumulated by the plating, first the soln. is introduced into an ion exchange vessel 5, where it is allowed to contact with anion exchange resins to exchange SO4 ions and CO3 ions to HCOO ions. Next, it is introduced into an electrodialysis vessel 6, where the HCOO ions and harmful ions of alkali metal ions such as Na are separated from chelated Cu ions, chelating agents, etc. as essential components and are selectively removed by electrodialysis, after which they are reflowed to a concd. liquid vessel 7. The regenerated plating soln. is reflowed to the vessel 1.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10773980A JPS5937745B2 (en) | 1980-08-07 | 1980-08-07 | Recycling treatment method and equipment for chemical copper plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10773980A JPS5937745B2 (en) | 1980-08-07 | 1980-08-07 | Recycling treatment method and equipment for chemical copper plating solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5732360A true JPS5732360A (en) | 1982-02-22 |
| JPS5937745B2 JPS5937745B2 (en) | 1984-09-11 |
Family
ID=14466722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10773980A Expired JPS5937745B2 (en) | 1980-08-07 | 1980-08-07 | Recycling treatment method and equipment for chemical copper plating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5937745B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05306471A (en) * | 1991-05-17 | 1993-11-19 | Hitachi Kasei Techno Plant Kk | Method and apparatus for producing electroless copper plating solution |
-
1980
- 1980-08-07 JP JP10773980A patent/JPS5937745B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05306471A (en) * | 1991-05-17 | 1993-11-19 | Hitachi Kasei Techno Plant Kk | Method and apparatus for producing electroless copper plating solution |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5937745B2 (en) | 1984-09-11 |
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