JPS57200549A - Continuous regeneration of chemical copper plating liquid - Google Patents
Continuous regeneration of chemical copper plating liquidInfo
- Publication number
- JPS57200549A JPS57200549A JP8573781A JP8573781A JPS57200549A JP S57200549 A JPS57200549 A JP S57200549A JP 8573781 A JP8573781 A JP 8573781A JP 8573781 A JP8573781 A JP 8573781A JP S57200549 A JPS57200549 A JP S57200549A
- Authority
- JP
- Japan
- Prior art keywords
- tank
- plating
- treatment
- pump
- valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title abstract 13
- 239000007788 liquid Substances 0.000 title abstract 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 230000008929 regeneration Effects 0.000 title 1
- 238000011069 regeneration method Methods 0.000 title 1
- 239000000126 substance Substances 0.000 title 1
- 230000001172 regenerating effect Effects 0.000 abstract 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 abstract 1
- 239000013522 chelant Substances 0.000 abstract 1
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 229910001431 copper ion Inorganic materials 0.000 abstract 1
- 238000011033 desalting Methods 0.000 abstract 1
- 238000000909 electrodialysis Methods 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D61/00—Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
- B01D61/42—Electrodialysis; Electro-osmosis ; Electro-ultrafiltration; Membrane capacitive deionization
- B01D61/44—Ion-selective electrodialysis
Landscapes
- Engineering & Computer Science (AREA)
- Water Supply & Treatment (AREA)
- Health & Medical Sciences (AREA)
- Urology & Nephrology (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemically Coating (AREA)
Abstract
PURPOSE: To continuously carry out plating treatment and regenerating treatment by a method wherein a twofold amount of a plating liquid required in plating treatment is divided into two baths and operation wherein plating treatment is carried out in one bath and, during this time, regenerating treatment is carried out in the other bath is alternately repeated.
CONSTITUTION: When harmful components are accumulated in a plating liquid containing a divalent copper ion, a chelate agent and a reducing agent thereof and an alkali metal hydroxide as essential components by subjecting the same to plating treatment in a first plating tank 1, it is momentarily stored in a preliminary tank 4 through a pump 2 and a valve 3. Into the empty tank 1, the plating liquid regenerated by regenerating treatment carried out in parallel with the aforementioned plating treatment is sent from a regenerating tank 7 through a pump 8 and a valve 9 to succeed the plating treatment. The deteriorated plating liquid in the tank 4 is sent into the emptied tank 7 through a pump 5 and a valve 6 and introduced into the desalting chamber 12 of an electrodialysis tank 11 through the pump 8 and the valve 9 to be desalted therein and the desalted plating liquid is recirculated to the tank 7. At the same time, a concentrated liquid having ions exhausted in the chamber dissolved therein is sent into a concentrating chamber 16 of the tank 11 from a concentrating tank 13 and recirculated to the concentrating tank 13.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8573781A JPS57200549A (en) | 1981-06-05 | 1981-06-05 | Continuous regeneration of chemical copper plating liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8573781A JPS57200549A (en) | 1981-06-05 | 1981-06-05 | Continuous regeneration of chemical copper plating liquid |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57200549A true JPS57200549A (en) | 1982-12-08 |
| JPS6341983B2 JPS6341983B2 (en) | 1988-08-19 |
Family
ID=13867147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8573781A Granted JPS57200549A (en) | 1981-06-05 | 1981-06-05 | Continuous regeneration of chemical copper plating liquid |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57200549A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06316769A (en) * | 1993-01-26 | 1994-11-15 | Nippon Parkerizing Co Ltd | Device and method for intermittently removing metal ion and contaminants from chemical bath |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52119428A (en) * | 1975-02-13 | 1977-10-06 | Kollmorgen Tech Corp | Method of separating deleterious byproducts from copper plating bath |
| JPS563666A (en) * | 1979-06-19 | 1981-01-14 | Hitachi Ltd | Method and apparatus for regenerating chemical copper plating solution |
-
1981
- 1981-06-05 JP JP8573781A patent/JPS57200549A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52119428A (en) * | 1975-02-13 | 1977-10-06 | Kollmorgen Tech Corp | Method of separating deleterious byproducts from copper plating bath |
| JPS563666A (en) * | 1979-06-19 | 1981-01-14 | Hitachi Ltd | Method and apparatus for regenerating chemical copper plating solution |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06316769A (en) * | 1993-01-26 | 1994-11-15 | Nippon Parkerizing Co Ltd | Device and method for intermittently removing metal ion and contaminants from chemical bath |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6341983B2 (en) | 1988-08-19 |
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