JPS5732361A - Activation copper colloid for metal plating insulation surface and manufacture - Google Patents

Activation copper colloid for metal plating insulation surface and manufacture

Info

Publication number
JPS5732361A
JPS5732361A JP10650180A JP10650180A JPS5732361A JP S5732361 A JPS5732361 A JP S5732361A JP 10650180 A JP10650180 A JP 10650180A JP 10650180 A JP10650180 A JP 10650180A JP S5732361 A JPS5732361 A JP S5732361A
Authority
JP
Japan
Prior art keywords
manufacture
metal plating
insulation surface
copper colloid
activation copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10650180A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0146590B2 (da
Inventor
Robaato Burasuku Uiriamu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
LeaRonal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LeaRonal Inc filed Critical LeaRonal Inc
Priority to JP10650180A priority Critical patent/JPS5732361A/ja
Publication of JPS5732361A publication Critical patent/JPS5732361A/ja
Publication of JPH0146590B2 publication Critical patent/JPH0146590B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP10650180A 1980-08-04 1980-08-04 Activation copper colloid for metal plating insulation surface and manufacture Granted JPS5732361A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10650180A JPS5732361A (en) 1980-08-04 1980-08-04 Activation copper colloid for metal plating insulation surface and manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10650180A JPS5732361A (en) 1980-08-04 1980-08-04 Activation copper colloid for metal plating insulation surface and manufacture

Publications (2)

Publication Number Publication Date
JPS5732361A true JPS5732361A (en) 1982-02-22
JPH0146590B2 JPH0146590B2 (da) 1989-10-09

Family

ID=14435177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10650180A Granted JPS5732361A (en) 1980-08-04 1980-08-04 Activation copper colloid for metal plating insulation surface and manufacture

Country Status (1)

Country Link
JP (1) JPS5732361A (da)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6066899A (ja) * 1983-09-22 1985-04-17 日本電気株式会社 印刷配線板の製造方法
JPWO2022085461A1 (da) * 2020-10-21 2022-04-28

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3958048A (en) * 1974-04-22 1976-05-18 Crown City Plating Company Aqueous suspensions for surface activation of nonconductors for electroless plating

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3958048A (en) * 1974-04-22 1976-05-18 Crown City Plating Company Aqueous suspensions for surface activation of nonconductors for electroless plating

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6066899A (ja) * 1983-09-22 1985-04-17 日本電気株式会社 印刷配線板の製造方法
JPWO2022085461A1 (da) * 2020-10-21 2022-04-28
WO2022085461A1 (ja) * 2020-10-21 2022-04-28 旭化成株式会社 導電性パターン付構造体の製造方法

Also Published As

Publication number Publication date
JPH0146590B2 (da) 1989-10-09

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