JPH0146590B2 - - Google Patents

Info

Publication number
JPH0146590B2
JPH0146590B2 JP55106501A JP10650180A JPH0146590B2 JP H0146590 B2 JPH0146590 B2 JP H0146590B2 JP 55106501 A JP55106501 A JP 55106501A JP 10650180 A JP10650180 A JP 10650180A JP H0146590 B2 JPH0146590 B2 JP H0146590B2
Authority
JP
Japan
Prior art keywords
copper
colloid
activation
zeta potential
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55106501A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5732361A (en
Inventor
Robaato Burasuku Uiriamu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RIIROONARU Inc
Original Assignee
RIIROONARU Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RIIROONARU Inc filed Critical RIIROONARU Inc
Priority to JP10650180A priority Critical patent/JPS5732361A/ja
Publication of JPS5732361A publication Critical patent/JPS5732361A/ja
Publication of JPH0146590B2 publication Critical patent/JPH0146590B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP10650180A 1980-08-04 1980-08-04 Activation copper colloid for metal plating insulation surface and manufacture Granted JPS5732361A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10650180A JPS5732361A (en) 1980-08-04 1980-08-04 Activation copper colloid for metal plating insulation surface and manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10650180A JPS5732361A (en) 1980-08-04 1980-08-04 Activation copper colloid for metal plating insulation surface and manufacture

Publications (2)

Publication Number Publication Date
JPS5732361A JPS5732361A (en) 1982-02-22
JPH0146590B2 true JPH0146590B2 (da) 1989-10-09

Family

ID=14435177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10650180A Granted JPS5732361A (en) 1980-08-04 1980-08-04 Activation copper colloid for metal plating insulation surface and manufacture

Country Status (1)

Country Link
JP (1) JPS5732361A (da)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6066899A (ja) * 1983-09-22 1985-04-17 日本電気株式会社 印刷配線板の製造方法
WO2022085461A1 (ja) * 2020-10-21 2022-04-28 旭化成株式会社 導電性パターン付構造体の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3958048A (en) * 1974-04-22 1976-05-18 Crown City Plating Company Aqueous suspensions for surface activation of nonconductors for electroless plating

Also Published As

Publication number Publication date
JPS5732361A (en) 1982-02-22

Similar Documents

Publication Publication Date Title
US5882736A (en) palladium layers deposition process
US4002778A (en) Chemical plating process
US3873360A (en) Method of depositing a metal on a surface of a substrate
EP0100452B1 (en) Method for conditioning a substrate for plating
JP2918339B2 (ja) パラジウム層析出方法
US4632857A (en) Electrolessly plated product having a polymetallic catalytic film underlayer
Barker Electroless deposition of metals
US5212138A (en) Low corrosivity catalyst for activation of copper for electroless nickel plating
US3485597A (en) Electroless deposition of nickel-phosphorus based alloys
DE69025495D1 (de) Abscheidung von Silberschichten auf nichtleitenden Substraten
JPS6325518B2 (da)
EP2767614A1 (en) Method for depositing a first metallic layer onto non-conductive polymers
US3668003A (en) Printed circuits
JP2004197221A (ja) 合成物質電気メッキ用基板の活性化方法
US4581256A (en) Electroless plating composition and method of use
US5219815A (en) Low corrosivity catalyst containing ammonium ions for activation of copper for electroless nickel plating
EP0044878B1 (en) A stable aqueous colloid for the activation of non-conductive substrates and the method of activating
US5843517A (en) Composition and method for selective plating
US4671968A (en) Method for electroless deposition of copper on conductive surfaces and on substrates containing conductive surfaces
US3841881A (en) Method for electroless deposition of metal using improved colloidal catalyzing solution
US4762560A (en) Copper colloid and method of activating insulating surfaces for subsequent electroplating
JPH08176837A (ja) 無電解ニッケルリンめっき液
JPH0146590B2 (da)
US4820547A (en) Activators for colloidal catalysts in electroless plating processes
US3650913A (en) An electroless plating process employing a specially prepared palladium-tin activator solution