JPS5732504B2 - - Google Patents

Info

Publication number: JPS5732504B2
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP8945173A

Other languages

Japanese (ja)

Other versions

JPS5039470A (mo

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1973-08-09

Filing date

1973-08-09

Publication date

1982-07-12

1973-08-09 Application filed filed Critical

1973-08-09 Priority to JP8945173A priority Critical patent/JPS5732504B2/ja

1975-04-11 Publication of JPS5039470A publication Critical patent/JPS5039470A/ja

1982-07-12 Publication of JPS5732504B2 publication Critical patent/JPS5732504B2/ja

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
- H10W72/07555—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in materials
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5528—Intermetallic compounds
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/922—Bond pads being integral with underlying chip-level interconnections
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/934—Cross-sectional shape, i.e. in side view
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

Wire Bonding (AREA)

JP8945173A 1973-08-09 1973-08-09 Expired JPS5732504B2 (mo)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP8945173A JPS5732504B2 (mo)	1973-08-09	1973-08-09

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP8945173A JPS5732504B2 (mo)	1973-08-09	1973-08-09

Publications (2)

Publication Number	Publication Date
JPS5039470A JPS5039470A (mo)	1975-04-11
JPS5732504B2 true JPS5732504B2 (mo)	1982-07-12

Family

ID=13971039

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP8945173A Expired JPS5732504B2 (mo)	1973-08-09	1973-08-09

Country Status (1)

Country	Link
JP (1)	JPS5732504B2 (mo)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS52101971A (en) *	1976-02-23	1977-08-26	Agency Of Ind Science & Technol	Semiconductor device
JPS614265A (ja) *	1984-06-19	1986-01-10	Rohm Co Ltd	半導体集積回路装置
JPS62267305A (ja) *	1986-05-15	1987-11-20	Sumitomo Chem Co Ltd	オレフイン重合体の製造法
JPH0761687B2 (ja) *	1988-07-09	1995-07-05	日本石油株式会社	高強度・高弾性率ポリエチレン材料の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS49114354A (mo) *	1973-02-28	1974-10-31

1973
- 1973-08-09 JP JP8945173A patent/JPS5732504B2/ja not_active Expired

Also Published As

Publication number	Publication date
JPS5039470A (mo)	1975-04-11

Publication	Publication Date	Title
AR201758A1 (mo)	1975-04-15
AU465372B2 (mo)	1975-09-25
AR201235Q (mo)	1975-02-21
AR201231Q (mo)	1975-02-21
AU474593B2 (mo)	1976-07-29
AU474838B2 (mo)	1976-08-05
AU465453B2 (mo)	1975-09-25
AU471343B2 (mo)	1976-04-15
AU465434B2 (mo)	1975-09-25
AU450229B2 (mo)	1974-07-04
AU476714B2 (mo)	1976-09-30
AR201229Q (mo)	1975-02-21
AU476696B2 (mo)	1976-09-30
AU472848B2 (mo)	1976-06-03
AU466283B2 (mo)	1975-10-23
AR199451A1 (mo)	1974-08-30
JPS5039470A (mo)	1975-04-11
AU477823B2 (mo)	1975-06-19
JPS49114354A (mo)	1974-10-31
AR200256A1 (mo)	1974-10-31
AU447540B2 (mo)	1974-03-25
AR197627A1 (mo)	1974-04-23
AR195948A1 (mo)	1973-11-15
AR195311A1 (mo)	1973-09-28
AR196382A1 (mo)	1973-12-18