JPS5732660A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5732660A
JPS5732660A JP10853980A JP10853980A JPS5732660A JP S5732660 A JPS5732660 A JP S5732660A JP 10853980 A JP10853980 A JP 10853980A JP 10853980 A JP10853980 A JP 10853980A JP S5732660 A JPS5732660 A JP S5732660A
Authority
JP
Japan
Prior art keywords
section
metallized
electrode
collector electrode
bridging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10853980A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6117138B2 (2
Inventor
Yasuichi Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10853980A priority Critical patent/JPS5732660A/ja
Publication of JPS5732660A publication Critical patent/JPS5732660A/ja
Publication of JPS6117138B2 publication Critical patent/JPS6117138B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/226—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for HF amplifiers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements

Landscapes

  • Wire Bonding (AREA)
JP10853980A 1980-08-04 1980-08-04 Semiconductor device Granted JPS5732660A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10853980A JPS5732660A (en) 1980-08-04 1980-08-04 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10853980A JPS5732660A (en) 1980-08-04 1980-08-04 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5732660A true JPS5732660A (en) 1982-02-22
JPS6117138B2 JPS6117138B2 (2) 1986-05-06

Family

ID=14487372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10853980A Granted JPS5732660A (en) 1980-08-04 1980-08-04 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5732660A (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007329502A (ja) * 2007-08-16 2007-12-20 Toshiba Corp 発光装置
JP2009065199A (ja) * 2008-11-17 2009-03-26 Toshiba Corp 発光装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5312271A (en) * 1976-07-20 1978-02-03 Nec Corp Substrate for electronic circuit element

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5312271A (en) * 1976-07-20 1978-02-03 Nec Corp Substrate for electronic circuit element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007329502A (ja) * 2007-08-16 2007-12-20 Toshiba Corp 発光装置
JP2009065199A (ja) * 2008-11-17 2009-03-26 Toshiba Corp 発光装置

Also Published As

Publication number Publication date
JPS6117138B2 (2) 1986-05-06

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