JPS573812A - Heat-resistant resin composition - Google Patents

Heat-resistant resin composition

Info

Publication number
JPS573812A
JPS573812A JP7666280A JP7666280A JPS573812A JP S573812 A JPS573812 A JP S573812A JP 7666280 A JP7666280 A JP 7666280A JP 7666280 A JP7666280 A JP 7666280A JP S573812 A JPS573812 A JP S573812A
Authority
JP
Japan
Prior art keywords
compound
boron
resin composition
reacting
mixture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7666280A
Other languages
Japanese (ja)
Inventor
Masamichi Kaneko
Shigenori Yamaoka
Masuo Mizuno
Yukihiro Okabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP7666280A priority Critical patent/JPS573812A/en
Publication of JPS573812A publication Critical patent/JPS573812A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: Titled composition which provides cured products excellent in dielectric properties, etc., prepared by mixing a complex salt obtained by reacting an imidazole compound with a boron halide compound with a mixture of an epoxy resin and an isocyanate compound.
CONSTITUTION: One eq. of an epoxy resin containing at least two epoxy groups in the molecule is mixed with about 0.2W3eq. of an isocyanate compound, e.g., methane diisocyanate, trans-vinylene diisocyanate. Then, to 100pts.wt. this mixture is added, as a reaction catalyst, about 0.01W10pts.wt. complex salt obtained by reacting an imidazole compound, e.g., 2-methylimidazole, 2-phenylimidazole, with a boron halide compound, e.g., boron fluoride, boron chloride, such as a compound of the formula, to obtain the resin composition of the purpose, suitable for laminated sheets, etc.
COPYRIGHT: (C)1982,JPO&Japio
JP7666280A 1980-06-09 1980-06-09 Heat-resistant resin composition Pending JPS573812A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7666280A JPS573812A (en) 1980-06-09 1980-06-09 Heat-resistant resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7666280A JPS573812A (en) 1980-06-09 1980-06-09 Heat-resistant resin composition

Publications (1)

Publication Number Publication Date
JPS573812A true JPS573812A (en) 1982-01-09

Family

ID=13611613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7666280A Pending JPS573812A (en) 1980-06-09 1980-06-09 Heat-resistant resin composition

Country Status (1)

Country Link
JP (1) JPS573812A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63141859U (en) * 1987-03-09 1988-09-19
JPS63193753U (en) * 1987-06-02 1988-12-13
US5314983A (en) * 1992-11-09 1994-05-24 Enichem S.P.A. Process for curing polymerizable liquid compositions based on polyisocyanates and epoxides

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63141859U (en) * 1987-03-09 1988-09-19
JPS63193753U (en) * 1987-06-02 1988-12-13
US5314983A (en) * 1992-11-09 1994-05-24 Enichem S.P.A. Process for curing polymerizable liquid compositions based on polyisocyanates and epoxides

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