JPS573814A - Heat-resistant resin composition - Google Patents
Heat-resistant resin compositionInfo
- Publication number
- JPS573814A JPS573814A JP7666480A JP7666480A JPS573814A JP S573814 A JPS573814 A JP S573814A JP 7666480 A JP7666480 A JP 7666480A JP 7666480 A JP7666480 A JP 7666480A JP S573814 A JPS573814 A JP S573814A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- resin composition
- boron
- heat
- aliphatic amine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title abstract 3
- 229920006015 heat resistant resin Polymers 0.000 title 1
- -1 aliphatic amine compound Chemical class 0.000 abstract 10
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract 4
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 abstract 3
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 abstract 2
- 229910052796 boron Inorganic materials 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 2
- 239000012948 isocyanate Substances 0.000 abstract 2
- 229920000647 polyepoxide Polymers 0.000 abstract 2
- 150000003839 salts Chemical class 0.000 abstract 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 abstract 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 abstract 1
- 229910015900 BF3 Inorganic materials 0.000 abstract 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 abstract 1
- 239000007809 chemical reaction catalyst Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- XJRAOMZCVTUHFI-UHFFFAOYSA-N isocyanic acid;methane Chemical compound C.N=C=O.N=C=O XJRAOMZCVTUHFI-UHFFFAOYSA-N 0.000 abstract 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Polyurethanes Or Polyureas (AREA)
Abstract
PURPOSE: Titled resin composition which provides cured products excellent in dielectric properties, prepared by mixing a complex salt, obtained from an aliphatic amine compound, an imidazole compound and a boron halide compound, with an epoxy resin and an isocyanate compound.
CONSTITUTION: One eq. of an epoxy resin having at least two epoxy groups in the molecule is mixed with about 0.2W3eq; of an isocyanate compound, e.g., methane diisocyanate. Then to 100pts.wt. this mixture is added, as a reaction catalyst, about 0.01W10pts.wt. complex salt obtained by reacting an aliphatic amine compound, e.g., methylamine, triethylamine, an imidazole compound, e.g., methylimidazole, 2-phenylimidazole, and a boron halide compound, e.g., boron fluoride, boron chloride, such as a compound of formula, to obtain the resin composition of the purpose, suitable for laminated sheets, etc.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55076664A JPS6036168B2 (en) | 1980-06-09 | 1980-06-09 | Heat resistant resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55076664A JPS6036168B2 (en) | 1980-06-09 | 1980-06-09 | Heat resistant resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS573814A true JPS573814A (en) | 1982-01-09 |
| JPS6036168B2 JPS6036168B2 (en) | 1985-08-19 |
Family
ID=13611671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55076664A Expired JPS6036168B2 (en) | 1980-06-09 | 1980-06-09 | Heat resistant resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6036168B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5314983A (en) * | 1992-11-09 | 1994-05-24 | Enichem S.P.A. | Process for curing polymerizable liquid compositions based on polyisocyanates and epoxides |
-
1980
- 1980-06-09 JP JP55076664A patent/JPS6036168B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5314983A (en) * | 1992-11-09 | 1994-05-24 | Enichem S.P.A. | Process for curing polymerizable liquid compositions based on polyisocyanates and epoxides |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6036168B2 (en) | 1985-08-19 |
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