JPS573821A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS573821A JPS573821A JP7779880A JP7779880A JPS573821A JP S573821 A JPS573821 A JP S573821A JP 7779880 A JP7779880 A JP 7779880A JP 7779880 A JP7779880 A JP 7779880A JP S573821 A JPS573821 A JP S573821A
- Authority
- JP
- Japan
- Prior art keywords
- reaction product
- polyamine
- dicarboxylic acid
- inorganic filler
- unsaturated dicarboxylic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title abstract 4
- 239000003822 epoxy resin Substances 0.000 title 1
- 229920000647 polyepoxide Polymers 0.000 title 1
- 150000001875 compounds Chemical class 0.000 abstract 4
- 239000007795 chemical reaction product Substances 0.000 abstract 3
- 239000004593 Epoxy Substances 0.000 abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 2
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 abstract 2
- 239000011256 inorganic filler Substances 0.000 abstract 2
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 2
- 229920000768 polyamine Polymers 0.000 abstract 2
- 229920001296 polysiloxane Polymers 0.000 abstract 2
- 150000004984 aromatic diamines Chemical class 0.000 abstract 1
- 239000004927 clay Substances 0.000 abstract 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 abstract 1
- -1 e.g. Substances 0.000 abstract 1
- 230000009477 glass transition Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 125000001183 hydrocarbyl group Chemical group 0.000 abstract 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 abstract 1
- 239000000047 product Substances 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Abstract
PURPOSE: Titled composition capable of forming cured products having low modulus of elasticity, low coefficient of expansion and high glass transition point, prepared by mixing a polyfunctional epoxy compound with a reaction product between an unsaturated dicarboxylic acid anhydride and a polyamine, a silicone compound and an inorganic filler at a specified ratio.
CONSTITUTION: The following components are mixed together: (A) 100pts.wt. polyfunctional epoxy compound, e.g., diglycidyl ether of bisphenol A, (B) about 20W70pts.wt. reaction product between an ethylenically unsaturated dicarboxylic acid anhydride (or its functional derivative) and a polyamine, e.g., a reaction product obtained by heating a mixture of 1mol of an aromatic diamine and not more than about 0.6mol of maleic anhydride, (C) about 1W60wt% silicone compound [R/Si≈1W1.7, R is an Si-bonded monovalent hydrocarbon group and content of Si-bonded OH ≥about 0.2wt%] and (D) an inorganic filler, e.g., silica, clay (40W 75vol% based on the total composition).
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7779880A JPS573821A (en) | 1980-06-11 | 1980-06-11 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7779880A JPS573821A (en) | 1980-06-11 | 1980-06-11 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS573821A true JPS573821A (en) | 1982-01-09 |
| JPS621609B2 JPS621609B2 (en) | 1987-01-14 |
Family
ID=13644010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7779880A Granted JPS573821A (en) | 1980-06-11 | 1980-06-11 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS573821A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5876455A (en) * | 1981-11-02 | 1983-05-09 | Matsushita Electric Works Ltd | Thermosetting resin molding material for sealing and molded electronic parts using the same |
| JPH0649363A (en) * | 1992-08-04 | 1994-02-22 | Shin Etsu Chem Co Ltd | Room temperature curable organopolysiloxane composition |
| JPH0770408A (en) * | 1994-03-16 | 1995-03-14 | Nitto Denko Corp | Semiconductor device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02200601A (en) * | 1989-01-30 | 1990-08-08 | Nozawagumi:Kk | Freezer of zygote, sperm or the like |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5364266A (en) * | 1976-11-22 | 1978-06-08 | Shin Etsu Chem Co Ltd | Epoxy-silicone resin compositions |
| JPS553412A (en) * | 1978-06-21 | 1980-01-11 | Hitachi Ltd | Epoxy resin composition |
| JPS5512124A (en) * | 1978-07-12 | 1980-01-28 | Hitachi Ltd | Thermosetting resin composition |
-
1980
- 1980-06-11 JP JP7779880A patent/JPS573821A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5364266A (en) * | 1976-11-22 | 1978-06-08 | Shin Etsu Chem Co Ltd | Epoxy-silicone resin compositions |
| JPS553412A (en) * | 1978-06-21 | 1980-01-11 | Hitachi Ltd | Epoxy resin composition |
| JPS5512124A (en) * | 1978-07-12 | 1980-01-28 | Hitachi Ltd | Thermosetting resin composition |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5876455A (en) * | 1981-11-02 | 1983-05-09 | Matsushita Electric Works Ltd | Thermosetting resin molding material for sealing and molded electronic parts using the same |
| JPH0649363A (en) * | 1992-08-04 | 1994-02-22 | Shin Etsu Chem Co Ltd | Room temperature curable organopolysiloxane composition |
| JPH0770408A (en) * | 1994-03-16 | 1995-03-14 | Nitto Denko Corp | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS621609B2 (en) | 1987-01-14 |
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