JPS5742003A - Intercepting device for of laser beam - Google Patents

Intercepting device for of laser beam

Info

Publication number
JPS5742003A
JPS5742003A JP55118149A JP11814980A JPS5742003A JP S5742003 A JPS5742003 A JP S5742003A JP 55118149 A JP55118149 A JP 55118149A JP 11814980 A JP11814980 A JP 11814980A JP S5742003 A JPS5742003 A JP S5742003A
Authority
JP
Japan
Prior art keywords
laser beam
shutter
width
slit
reflected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55118149A
Other languages
Japanese (ja)
Inventor
Hiroshi Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp, Olympus Optical Co Ltd filed Critical Olympus Corp
Priority to JP55118149A priority Critical patent/JPS5742003A/en
Publication of JPS5742003A publication Critical patent/JPS5742003A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/02—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the intensity of light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)

Abstract

PURPOSE:To intercept a laser beam quickly and precisely by providing a shutter for intercepting the laser beam to a turning shaft intersecting orthogonally with the optical axis of the laser beam. CONSTITUTION:A shutter 4 is mounted to the leading end of a turning shaft 3 intersecting orthogonally with the laser beam L from a laser 1. If the shutter 4 is turned by theta in an arrow direction by a driving source 2, the half of the laser beam L is reflected by falling to the end face of the shutter 4 and the other half is reflected by the inside wall surface of a slit 5, whereby it passage to a rectilinear direction is intercepted. If the width of the laser beam L is set at 1mm., the width of the slit 5 at 1.5mm. and the width of the shutter 4 at 5mm., the rotating angle theta is a small value of about 16.6 deg.. Since the angular moment is small, the laser beam is intercepted quickly precisely.
JP55118149A 1980-08-27 1980-08-27 Intercepting device for of laser beam Pending JPS5742003A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55118149A JPS5742003A (en) 1980-08-27 1980-08-27 Intercepting device for of laser beam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55118149A JPS5742003A (en) 1980-08-27 1980-08-27 Intercepting device for of laser beam

Publications (1)

Publication Number Publication Date
JPS5742003A true JPS5742003A (en) 1982-03-09

Family

ID=14729290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55118149A Pending JPS5742003A (en) 1980-08-27 1980-08-27 Intercepting device for of laser beam

Country Status (1)

Country Link
JP (1) JPS5742003A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0289401U (en) * 1988-08-22 1990-07-16
US6762866B2 (en) * 2001-12-03 2004-07-13 Lockheed Martin Corporation High speed mechanical laser shutter
US7626746B2 (en) 2003-11-04 2009-12-01 Hamamatsu Photonics K.K. Shutter unit and laser processing device using same
JP2014102516A (en) * 2006-11-20 2014-06-05 Alcon Inc System and method for illumination attenuation

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0289401U (en) * 1988-08-22 1990-07-16
US6762866B2 (en) * 2001-12-03 2004-07-13 Lockheed Martin Corporation High speed mechanical laser shutter
US7626746B2 (en) 2003-11-04 2009-12-01 Hamamatsu Photonics K.K. Shutter unit and laser processing device using same
JP2014102516A (en) * 2006-11-20 2014-06-05 Alcon Inc System and method for illumination attenuation

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