JPS5748854B2 - - Google Patents

Info

Publication number: JPS5748854B2
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP48027070A

Other languages

Japanese (ja)

Other versions

JPS49116961A (th

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1973-03-09

Filing date

1973-03-09

Publication date

1982-10-19

1973-03-09 Application filed filed Critical

1973-03-09 Priority to JP48027070A priority Critical patent/JPS5748854B2/ja

1974-11-08 Publication of JPS49116961A publication Critical patent/JPS49116961A/ja

1982-10-19 Publication of JPS5748854B2 publication Critical patent/JPS5748854B2/ja

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07553—Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/922—Bond pads being integral with underlying chip-level interconnections
- H10W72/9226—Bond pads being integral with underlying chip-level interconnections with via interconnections
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/923—Bond pads having multiple stacked layers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/934—Cross-sectional shape, i.e. in side view

Landscapes

Bipolar Transistors (AREA)
Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Wire Bonding (AREA)

JP48027070A 1973-03-09 1973-03-09 Expired JPS5748854B2 (th)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP48027070A JPS5748854B2 (th)	1973-03-09	1973-03-09

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP48027070A JPS5748854B2 (th)	1973-03-09	1973-03-09

Related Child Applications (1)

Application Number	Title	Priority Date	Filing Date
JP56024306A Division JPS594853B2 (ja)	1981-02-23	1981-02-23	半導体装置

Publications (2)

Publication Number	Publication Date
JPS49116961A JPS49116961A (th)	1974-11-08
JPS5748854B2 true JPS5748854B2 (th)	1982-10-19

Family

ID=12210794

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP48027070A Expired JPS5748854B2 (th)	1973-03-09	1973-03-09

Country Status (1)

Country	Link
JP (1)	JPS5748854B2 (th)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS51114833A (en) *	1975-04-02	1976-10-08	Hitachi Ltd	Bubble memory device
JPS528785A (en) *	1975-07-10	1977-01-22	Citizen Watch Co Ltd	Semiconductor device electrode structure
JPS5851425B2 (ja) *	1975-08-22	1983-11-16	株式会社日立製作所	ハンドウタイソウチ
JPS5833705B2 (ja) *	1975-08-27	1983-07-21	株式会社日立製作所	タソウハイセンオユウスルハンドウタイソウチ
JPS56172028U (th) *	1980-05-22	1981-12-18
JPS594853B2 (ja) *	1981-02-23	1984-02-01	株式会社日立製作所	半導体装置
JPS60182772A (ja) *	1984-02-29	1985-09-18	Rohm Co Ltd	半導体装置
JPS61102053U (th) *	1984-12-11	1986-06-28
JPS61232637A (ja) *	1985-04-09	1986-10-16	Nec Corp	半導体装置
JPH0311897Y2 (th) *	1986-07-18	1991-03-20

1973
- 1973-03-09 JP JP48027070A patent/JPS5748854B2/ja not_active Expired

Also Published As

Publication number	Publication date
JPS49116961A (th)	1974-11-08

Publication	Publication Date	Title
AR201758A1 (th)	1975-04-15
AU476761B2 (th)	1976-09-30
AU465372B2 (th)	1975-09-25
AR201235Q (th)	1975-02-21
AR201231Q (th)	1975-02-21
AU474593B2 (th)	1976-07-29
AU474511B2 (th)	1976-07-22
AU474838B2 (th)	1976-08-05
AU465453B2 (th)	1975-09-25
AU471343B2 (th)	1976-04-15
AU465434B2 (th)	1975-09-25
AU450229B2 (th)	1974-07-04
AU476714B2 (th)	1976-09-30
BR7401663D0 (th)	1974-11-05
JPS49116961A (th)	1974-11-08
AR201229Q (th)	1975-02-21
AU472848B2 (th)	1976-06-03
AU466283B2 (th)	1975-10-23
AU476696B2 (th)	1976-09-30
AU477823B2 (th)	1975-06-19
AU447540B2 (th)	1974-03-25
AR210729A1 (th)	1977-09-15
AR195948A1 (th)	1973-11-15
AU461342B2 (th)	1975-05-22
AU476873B1 (th)	1975-01-09