JPS5754328A - Genatsukisoseichosochi - Google Patents
GenatsukisoseichosochiInfo
- Publication number
- JPS5754328A JPS5754328A JP12931180A JP12931180A JPS5754328A JP S5754328 A JPS5754328 A JP S5754328A JP 12931180 A JP12931180 A JP 12931180A JP 12931180 A JP12931180 A JP 12931180A JP S5754328 A JPS5754328 A JP S5754328A
- Authority
- JP
- Japan
- Prior art keywords
- gas
- pipe
- substrates
- gas pipes
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012808 vapor phase Substances 0.000 title abstract 2
- 239000007789 gas Substances 0.000 abstract 8
- 239000000758 substrate Substances 0.000 abstract 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 2
- 230000006866 deterioration Effects 0.000 abstract 2
- 239000005368 silicate glass Substances 0.000 abstract 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 abstract 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 229910052757 nitrogen Inorganic materials 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45561—Gas plumbing upstream of the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45578—Elongated nozzles, tubes with holes
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12931180A JPS5754328A (ja) | 1980-09-19 | 1980-09-19 | Genatsukisoseichosochi |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12931180A JPS5754328A (ja) | 1980-09-19 | 1980-09-19 | Genatsukisoseichosochi |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5754328A true JPS5754328A (ja) | 1982-03-31 |
Family
ID=15006426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12931180A Pending JPS5754328A (ja) | 1980-09-19 | 1980-09-19 | Genatsukisoseichosochi |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5754328A (ja) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6010715A (ja) * | 1983-06-30 | 1985-01-19 | Fujitsu Ltd | 化学気相成長装置 |
| JPS62214614A (ja) * | 1986-03-17 | 1987-09-21 | Fujitsu Ltd | 減圧cvd装置 |
| JPS63240032A (ja) * | 1987-03-27 | 1988-10-05 | Semiconductor Energy Lab Co Ltd | 酸化珪素被膜の高速成膜法 |
| JPS6421917A (en) * | 1987-07-16 | 1989-01-25 | Fujitsu Ltd | Heating furnace processing method |
| USRE36328E (en) * | 1988-03-31 | 1999-10-05 | Kabushiki Kaisha Toshiba | Semiconductor manufacturing apparatus including temperature control mechanism |
| EP4060077A3 (en) * | 2021-03-16 | 2022-12-14 | Kokusai Electric Corp. | Substrate processing apparatus, method of manufacturing semiconductor device and program |
-
1980
- 1980-09-19 JP JP12931180A patent/JPS5754328A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6010715A (ja) * | 1983-06-30 | 1985-01-19 | Fujitsu Ltd | 化学気相成長装置 |
| JPS62214614A (ja) * | 1986-03-17 | 1987-09-21 | Fujitsu Ltd | 減圧cvd装置 |
| JPS63240032A (ja) * | 1987-03-27 | 1988-10-05 | Semiconductor Energy Lab Co Ltd | 酸化珪素被膜の高速成膜法 |
| JPS6421917A (en) * | 1987-07-16 | 1989-01-25 | Fujitsu Ltd | Heating furnace processing method |
| USRE36328E (en) * | 1988-03-31 | 1999-10-05 | Kabushiki Kaisha Toshiba | Semiconductor manufacturing apparatus including temperature control mechanism |
| EP4060077A3 (en) * | 2021-03-16 | 2022-12-14 | Kokusai Electric Corp. | Substrate processing apparatus, method of manufacturing semiconductor device and program |
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