JPS5754355A - Plastic molded type semiconductor device - Google Patents

Plastic molded type semiconductor device

Info

Publication number
JPS5754355A
JPS5754355A JP13049580A JP13049580A JPS5754355A JP S5754355 A JPS5754355 A JP S5754355A JP 13049580 A JP13049580 A JP 13049580A JP 13049580 A JP13049580 A JP 13049580A JP S5754355 A JPS5754355 A JP S5754355A
Authority
JP
Japan
Prior art keywords
heat radiating
radiating plate
resin
lead frame
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13049580A
Other languages
Japanese (ja)
Other versions
JPS6130426B2 (en
Inventor
Yuzaburo Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP13049580A priority Critical patent/JPS5754355A/en
Publication of JPS5754355A publication Critical patent/JPS5754355A/en
Publication of JPS6130426B2 publication Critical patent/JPS6130426B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent bending of a heat radiating plate and to eliminate destruction of element of a plastic molded type semiconductor device by a method wherein a lead frame is squashed to the nearly rectangular heat radiating plate formed with a groove part to provide an element and is formed in one body, and moreover the element and the lead part are sealed with a resin. CONSTITUTION:The -shape groove 22 is provided on the surface of the heat radiating plate 21 to be provided with the semiconductor element 2, and two cylindrical projections 23 are provided at both the sides interposing intervals between the groove. While notch parts 24 are provided at the circumference of the heat radiating plate 21, and U-shape concave parts 25 on the back. Penetrating holes 31 of the lead frame 27 are inserted on the cylindrical projections 23 of the heat radiating plate 21, and by squashing the projections 23 and a multistep bending part 27a, the lead frame is fixed to the heat radiating plate 21 and is formed in one body. Then the semiconductor element 2 is provided, and after metal wires 4 are formed, the semiconductor element 2 is sealed with the resin 32. At this time, the resin 32 buries and is connected to the U-shape concave parts 25 through the notch parts 24, and close adhesion between the heat radiating plate 21 and the sealing resin 32 can be held.
JP13049580A 1980-09-19 1980-09-19 Plastic molded type semiconductor device Granted JPS5754355A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13049580A JPS5754355A (en) 1980-09-19 1980-09-19 Plastic molded type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13049580A JPS5754355A (en) 1980-09-19 1980-09-19 Plastic molded type semiconductor device

Publications (2)

Publication Number Publication Date
JPS5754355A true JPS5754355A (en) 1982-03-31
JPS6130426B2 JPS6130426B2 (en) 1986-07-14

Family

ID=15035624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13049580A Granted JPS5754355A (en) 1980-09-19 1980-09-19 Plastic molded type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5754355A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5784751U (en) * 1980-11-12 1982-05-25
JPS60183754A (en) * 1984-03-01 1985-09-19 Toshiba Corp Resin sealed semiconductor device
JPS63197362A (en) * 1987-02-12 1988-08-16 Toshiba Corp Hybrid semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5784751U (en) * 1980-11-12 1982-05-25
JPS60183754A (en) * 1984-03-01 1985-09-19 Toshiba Corp Resin sealed semiconductor device
JPS63197362A (en) * 1987-02-12 1988-08-16 Toshiba Corp Hybrid semiconductor device

Also Published As

Publication number Publication date
JPS6130426B2 (en) 1986-07-14

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