JPS5759367A - Semiconductor container - Google Patents

Semiconductor container

Info

Publication number
JPS5759367A
JPS5759367A JP55133802A JP13380280A JPS5759367A JP S5759367 A JPS5759367 A JP S5759367A JP 55133802 A JP55133802 A JP 55133802A JP 13380280 A JP13380280 A JP 13380280A JP S5759367 A JPS5759367 A JP S5759367A
Authority
JP
Japan
Prior art keywords
leads
ceramic substrate
inner leads
parts
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55133802A
Other languages
Japanese (ja)
Inventor
Nobuhiko Mizuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55133802A priority Critical patent/JPS5759367A/en
Publication of JPS5759367A publication Critical patent/JPS5759367A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the deviation of pitches of inner leads and to improve efficiency and a yield of wire bonding by inserting and fixing the tip parts of the inner leads of a lead frame to the gaps between a comb shaped protruded parts provided in a ceramic substrate. CONSTITUTION:A plurality of the comb shaped protruded parts 7 whose width is slightly narrower than the gaps between the leads are provided at the positions where the tip parts of the inner leads 5 are provided on the upper surface of a ceramic substrate 1' forming a cerdip type semiconductor container, and the same pitch as that of the leads. The comb shape may be of a trapezoid, a rectangle, a triangle, or a curved surface. The tip of each inner lead is inserted into the gap between the protruded parts on the ceramic substrate 1, and fixed. In this constitution, the error in the pitch of the inner leads are decreased, and the bonding efficiency can be improved.
JP55133802A 1980-09-26 1980-09-26 Semiconductor container Pending JPS5759367A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55133802A JPS5759367A (en) 1980-09-26 1980-09-26 Semiconductor container

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55133802A JPS5759367A (en) 1980-09-26 1980-09-26 Semiconductor container

Publications (1)

Publication Number Publication Date
JPS5759367A true JPS5759367A (en) 1982-04-09

Family

ID=15113369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55133802A Pending JPS5759367A (en) 1980-09-26 1980-09-26 Semiconductor container

Country Status (1)

Country Link
JP (1) JPS5759367A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS584959A (en) * 1981-06-30 1983-01-12 Shinko Electric Ind Co Ltd Semiconductor device
JPS5882552A (en) * 1981-11-12 1983-05-18 Shinko Electric Ind Co Ltd Semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5311041B2 (en) * 1972-09-01 1978-04-19
JPS5390867A (en) * 1977-01-21 1978-08-10 Hitachi Ltd Glass hermetic sealing for lead wire

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5311041B2 (en) * 1972-09-01 1978-04-19
JPS5390867A (en) * 1977-01-21 1978-08-10 Hitachi Ltd Glass hermetic sealing for lead wire

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS584959A (en) * 1981-06-30 1983-01-12 Shinko Electric Ind Co Ltd Semiconductor device
JPS5882552A (en) * 1981-11-12 1983-05-18 Shinko Electric Ind Co Ltd Semiconductor device

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