JPS5769764A - Connecting structure of fet - Google Patents

Connecting structure of fet

Info

Publication number
JPS5769764A
JPS5769764A JP55144372A JP14437280A JPS5769764A JP S5769764 A JPS5769764 A JP S5769764A JP 55144372 A JP55144372 A JP 55144372A JP 14437280 A JP14437280 A JP 14437280A JP S5769764 A JPS5769764 A JP S5769764A
Authority
JP
Japan
Prior art keywords
fet
conductor
metal plate
slit
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55144372A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6318881B2 (2
Inventor
Masaki Noda
Takao Shinkawa
Chuichi Sodeyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55144372A priority Critical patent/JPS5769764A/ja
Publication of JPS5769764A publication Critical patent/JPS5769764A/ja
Publication of JPS6318881B2 publication Critical patent/JPS6318881B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Microwave Amplifiers (AREA)
  • Wire Bonding (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Waveguide Connection Structure (AREA)
JP55144372A 1980-10-17 1980-10-17 Connecting structure of fet Granted JPS5769764A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55144372A JPS5769764A (en) 1980-10-17 1980-10-17 Connecting structure of fet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55144372A JPS5769764A (en) 1980-10-17 1980-10-17 Connecting structure of fet

Publications (2)

Publication Number Publication Date
JPS5769764A true JPS5769764A (en) 1982-04-28
JPS6318881B2 JPS6318881B2 (2) 1988-04-20

Family

ID=15360580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55144372A Granted JPS5769764A (en) 1980-10-17 1980-10-17 Connecting structure of fet

Country Status (1)

Country Link
JP (1) JPS5769764A (2)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58135114U (ja) * 1982-03-08 1983-09-10 株式会社東芝 マイクロ波ｆｅｔ増幅器
JPS59224148A (ja) * 1983-06-02 1984-12-17 Sumitomo Electric Ind Ltd 半導体素子用パツケ−ジ
JPS6049675A (ja) * 1983-08-29 1985-03-18 Fujitsu Ltd 半導体装置
EP2911487A1 (en) * 2014-02-21 2015-08-26 Autoliv Development AB Circuit board mounting arrangement

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58135114U (ja) * 1982-03-08 1983-09-10 株式会社東芝 マイクロ波ｆｅｔ増幅器
JPS59224148A (ja) * 1983-06-02 1984-12-17 Sumitomo Electric Ind Ltd 半導体素子用パツケ−ジ
JPS6049675A (ja) * 1983-08-29 1985-03-18 Fujitsu Ltd 半導体装置
EP2911487A1 (en) * 2014-02-21 2015-08-26 Autoliv Development AB Circuit board mounting arrangement

Also Published As

Publication number Publication date
JPS6318881B2 (2) 1988-04-20

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